Heat Removal Mechanism for Stack-Based Electronic Device
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Solution Overview
Problem
The increasing miniaturization and complexity of electronic devices with multiple components on printed circuit boards lead to heat dissipation challenges, causing inefficiencies and potential overheating due to the spacing required for heat management.
Innovation Solution
A compact electronic device design incorporating a stack of electrically conductive and insulating layer structures with a process control component and heat removal structures to efficiently manage heat dissipation by positioning heat removal structures strategically for thermal paths between components and a mounting base.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple silicon dies are combined in a compact electronic device, then space is saved and functionality is increased, but heat dissipation becomes problematic due to closely spaced components
Solution Approach 1:
The patent transitions from two-dimensional planar mounting to three-dimensional vertical stacking, arranging multiple silicon dies and component carriers in a stacked configuration. This dimensional change allows components to be closely spaced vertically while maintaining heat dissipation paths, resolving the contradiction between compact size and heat management.
Solution Approach 2:
The patent divides the electronic device into multiple discrete component carriers and silicon dies that can be independently managed thermally. Each component carrier can be equipped with its own heat removal structure, allowing segmented heat dissipation management that enables compact stacking while addressing thermal issues of individual components.
2Temperature
If silicon dies are spaced significantly apart, then heat dissipation is improved, but the device becomes space-consuming and compactness is lost
Solution Approach 1:
By stacking component carriers vertically in the third dimension, the patent achieves both compact horizontal footprint and adequate thermal management. The vertical arrangement allows heat removal structures to be positioned on outer surfaces facing away from the stack, providing heat dissipation paths without requiring horizontal spacing between components.
Solution Approach 2:
The patent introduces heat removal structures as intermediary elements between the silicon dies and the external environment. These structures conduct heat away from the closely spaced components through dedicated thermal paths, enabling compact component arrangement while maintaining effective heat dissipation.
3Area of stationary object
If components are mounted on both faces of a component carrier, then space in the horizontal plane is saved, but heat dissipation of components facing the carrier becomes problematic
Solution Approach 1:
The patent resolves the heat dissipation issue for双面 mounted components by utilizing the vertical dimension and outer surfaces of the stacked configuration. Heat removal structures are positioned on the external faces of the stack, providing thermal paths for components on both faces of each carrier without requiring horizontal spacing.
Solution Approach 2:
Heat removal structures serve as intermediary thermal management elements that conduct heat away from components mounted on both faces of component carriers. These structures are strategically positioned on the outer surfaces of the stack, providing dedicated heat dissipation paths that do not interfere with the compact horizontal arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient heat removal and compact configuration, preventing overheating and allowing for closer component placement, thereby enhancing thermal performance and system reliability.
Implementation Method 1
a heat removal structure on or above which at least one of the process control component and the processing components is arranged for removing heat away from the stack
Data Source
AI summary
An electronic device includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a plurality of processing components on and/or in the stack, a process control component coupled with at least part of the processing components for transmitting signals and configured for controlling processes executed by the processing components and/or by the process control component, and a heat removal structure on or above which at least one of the process control component and the processing components is arranged.