Heat-Resistant Ceramic Substrate for Current Detection
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Solution Overview
Problem
Current current sensors using printed boards in harsh environments face reliability issues due to thermal expansion and deformation, which affect their current-sensing ability.
Innovation Solution
A heat-resistance element with a ceramic substrate, embedded power wires, and a coil structure configured by coil segments around the power wires, where conductors and connection wires are embedded within the substrate to maintain accuracy and resist thermal influence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a current sensor using a printed board is placed in a harsh environment, then the device can be manufactured with ease and lower cost, but the printed board may thermally expand and/or thermally deform, possibly lowering a current-sensing ability due to geometric change of wiring
Solution Approach 1:
The patent changes the material parameter of the substrate from conventional printed board material to heat-resistant ceramic material. This parameter change enables the substrate to resist thermal expansion and deformation in harsh environments, thereby maintaining the geometric stability of embedded conductors and wires while preserving current-sensing accuracy.
Solution Approach 2:
The patent employs composite material structure by embedding conductive materials (such as metal wires or conductive paste) within the heat-resistant ceramic substrate. This composite approach combines the thermal stability of ceramic with the electrical conductivity of metal, achieving both heat resistance and electrical functionality required for current sensing in harsh environments.
2Reliability
If conductors and connection wires are embedded in the heat-resistant substrate, then the heat-resistance and reliability are enhanced, but the device complexity increases
Solution Approach 1:
The patent merges multiple functional elements (conductors, connection wires, and substrate) into a single integrated structure by embedding them within the heat-resistant ceramic substrate during the firing process. This consolidation reduces the number of separate components and assembly steps, thereby enhancing reliability through fewer potential failure points while managing structural complexity through integration.
Solution Approach 2:
The patent employs preliminary action by embedding all conductors and connection wires into the substrate before the final firing process. This preliminary arrangement allows the entire structure to be formed and stabilized in one thermal processing step, ensuring proper positioning and electrical connections are established before the substrate achieves its final heat-resistant properties, thereby simplifying the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the heat-resistance and reliability of current detection in harsh environments by suppressing thermal expansion and deformation, thereby improving the accuracy of current sensing.
Implementation Method 1
the heat-resistant substrate including a ceramic material... suppressing thermal expansion and deformation
Implementation Method 2
a coil structure for detecting a current flowing in the one or more power wires
Data Source
AI summary
A heat-resistance element includes: a heat-resistant substrate including a ceramic material; one or more power wires embedded in the heat-resistant substrate; and a coil structure that is configured by a coil wire extending between start and end points and includes coil segments. The coil segment includes or corresponds to one winding of the coil wire. The coil segment includes: a first conductor extending along the power wire; a second conductor arranged farther from the one or more power wires than the first conductor, the second conductor extending along the power wire; a first connection wire coupling the first and second conductors in the same coil segment; and a second connection wire coupling first and second conductors of adjacent coil segments in the circumferential direction, all of which are embedded in the heat-resistant substrate, and at least the first conductor and the second conductor are not exposed from the heat-resistant substrate.