Heat-Resistant Resin Composition for Flat Step-Embedded Insulation Films
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Heat-resistant resin compositions struggle to effectively cover step parts in narrow pitch, high aspect coil patterns, leading to surface flatness issues and processing accuracy deterioration in laminated coil structures.
Innovation Solution
A heat-resistant resin composition comprising a polyimide, polybenzoxazole, or their precursors, combined with specific organic solvents having boiling points within defined ranges and solubility parameters, applied and dried to form a coating film that is then heat-treated to achieve excellent step embedding properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a polyimide resin composition containing a basic substance is used to neutralize carboxylic acid groups and prevent yellowing, then yellowing resistance is improved, but the resin composition becomes insufficiently heat-resistant and cannot be processed at high temperatures
Solution Approach 1:
The patent uses a composite resin system combining polyimide resin with a specific cyclic carboxylic acid component (cyclic anhydride or cyclic ester) that reacts with basic substances to form heat-resistant salt structures. This composite approach allows the material to simultaneously achieve yellowing resistance through basic substance neutralization and heat resistance through the stable cyclic carboxylic acid framework that maintains structural integrity at high processing temperatures
2Temperature
If conventional polyimide resin compositions are used, then heat resistance is maintained, but yellowing occurs during high-temperature processing and long-term use
Solution Approach 1:
The patent converts the potentially harmful carboxylic acid groups (which cause yellowing) into beneficial structures by reacting them with basic substances in the presence of cyclic carboxylic acid components. The cyclic carboxylic acid structures stabilize the neutralized form, transforming the yellowing-prone carboxylic acid groups into heat-resistant, non-yellowing salt structures that maintain both heat resistance and color stability
3Object-affected harmful factors
If the content of basic substance is increased to improve yellowing resistance, then yellowing is suppressed, but the resin composition becomes unstable and processing becomes difficult
Solution Approach 1:
The patent optimizes the parameters by controlling the basic substance content within a specific range (0.1-5 mass% based on polyimide resin) and incorporating cyclic carboxylic acid components at controlled ratios (5-50 mass% based on total resin). These parameter changes ensure sufficient neutralization of carboxylic acid groups for yellowing resistance while maintaining composition stability and processability through the stabilizing effect of cyclic carboxylic acid structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides a flat surface with enhanced step embedding properties, improving the processing accuracy of coil patterns by ensuring adequate coverage and retention of film flatness during the drying and curing processes.
Implementation Method 1
contains a cyclic carboxylic acid component and a basic substance, wherein the cyclic carboxylic acid component and the basic substance form a salt with each other
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The purpose of the present invention is to provide a heat-resistant resin composition having excellent stepped embedding properties on a support substrate. In order to achieve the aforementioned purpose, the present invention is configured as described below. Specifically, the present invention is a heat-resistant resin composition containing: as a resin (A) one or more types of resin selected from the group consisting of a polyimide precursor, and a polybenzoxazole precursor; as an organic solvent (B) an organic solvent having a boiling point of 210°C to 260°C at atmospheric pressure; and as an organic solvent (C) an organic solvent having a boiling point of 100°C to less than 210°C at atmospheric pressure; the content of the organic solvent (B) being 5% by mass to 70% by mass with respect to the entire amount of the organic solvents, and the content of the organic solvent (C) being 30% by mass to 95% by mass with respect to the entire amount of the organic solvents.