Heat Rings for Thermal Management in Package-on-Package Stacks
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In multi-chip or package systems, thermal coupling between components leads to performance degradation due to increased temperature, particularly in heat-generating processing units like APUs, which affects the performance of adjacent devices such as memory chips.
Innovation Solution
The implementation of heat rings made from conductive materials like silver, copper, or composite polymers around the bottom package in a Package-on-Package configuration to dissipate thermal energy away from the heat-generating components, thereby maintaining the integration density while preventing performance degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple chip packages are stacked vertically to reduce product size, then integration density is improved, but thermal coupling between packages increases causing performance degradation
Solution Approach 1:
A thermally conductive adhesive layer is introduced as an intermediary substance between the first and second packages. This adhesive layer serves as a thermal management interface that facilitates controlled heat transfer while maintaining the vertical stacking configuration, thereby reducing thermal coupling effects between adjacent packages.
Solution Approach 2:
The patent modifies the thermal parameters of the interface between packages by using a thermally conductive adhesive with specific thermal conductivity properties. This changes the thermal interaction characteristics between packages, allowing for better heat dissipation while maintaining compact vertical stacking.
2Adaptability or versatility
If heat-generating processing units are integrated into the package, then functionality is improved, but thermal energy transfer to adjacent components increases
Solution Approach 1:
The thermally conductive adhesive acts as a mediator between heat-generating processing units and adjacent components, providing a controlled thermal interface that manages heat flow pathways and reduces unwanted thermal energy transfer to sensitive adjacent components.
Solution Approach 2:
The patent extracts and manages the thermal energy generated by processing units through the use of thermally conductive materials, separating the heat management function from the structural bonding function by introducing a specialized thermal interface layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat rings effectively reduce thermal energy transfer between components, ensuring improved performance and reliability of thermally sensitive systems by managing heat dissipation efficiently.
Implementation Method 1
The implementation of heat rings made from conductive materials like silver, copper, or composite polymers around the bottom package in a Package-on-Package configuration to dissipate thermal energy
Data Source
AI summary
A method and structure for providing improved thermal management in multichip and package on package (PoP) applications. A first substrate attached to a second smaller substrate wherein the second substrate is encircled by a heat ring attached to the first substrate, the heat ring comprising heat conducting materials and efficient heat dissipating geometries. The first substrate comprises a heat generating chip and the second substrate comprises a heat sensitive chip. A method is presented providing the assembled structure with increased heat dissipation away from the heat sensitive chip.