Heat-Conductive Sheet Composition for Adhesion and Breakdown Voltage
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Solution Overview
Problem
Conventional thermal conductive sheets face challenges in achieving both high heat dissipation capability and breakdown voltage due to insufficient adhesion when the surface of the adherend is not flat, primarily because of high inorganic filler content reducing the thermosetting resin content, leading to poor adhesion and increased thermal resistance.
Innovation Solution
A thermal conductive sheet with a resin layer composed of a thermosetting resin, a curing agent, and an inorganic filler, where the curing agent is a benzoxazine derivative, enhances adhesion and maintains a high content of inorganic filler, ensuring improved heat dissipation and breakdown voltage even on non-flat surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the content of inorganic filler in the resin layer is increased to improve thermal conductive properties, then heat dissipation capability is improved, but the content of thermosetting resin decreases leading to insufficient adhesion to the heat sink surface
Solution Approach 1:
The patent changes the chemical composition parameters of the resin layer by specifying a particular thermosetting resin (epoxy resin with specific molecular weight range of 1,000-10,000) and curing agent combination, along with controlled filler content (30-80 vol%), to achieve optimal balance between adhesion and thermal conductivity
Solution Approach 2:
The patent creates a composite resin layer combining organic thermosetting resin matrix with inorganic filler particles, where the resin content is optimized to provide both adequate adhesion to non-flat surfaces and sufficient thermal conduction through the filler network
2Temperature
If the content of inorganic filler in the resin layer is increased to improve thermal conductive properties, then heat dissipation capability is improved, but the break down voltage decreases
Solution Approach 1:
The patent optimizes the resin composition parameters including thermosetting resin type (epoxy resin), curing agent selection, and filler content ratio to achieve a balance where thermal conductivity is enhanced while maintaining adequate electrical insulation properties through sufficient resin matrix continuity
3Adaptability or versatility
If the surface of the adherend is not sufficiently flat, then manufacturing flexibility is improved, but the adhesion between the adherend and resin layer becomes insufficient
Solution Approach 1:
The patent modifies the resin composition by selecting specific epoxy resin molecular weights (1,000-10,000) and adjusting the resin-to-filler ratio to create a material with optimal viscosity and adhesion properties that can conform to and bond with non-flat surfaces while maintaining structural integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sheet achieves enhanced adhesion, improved heat dissipation capability, and increased breakdown voltage by using a benzoxazine derivative as the curing agent, allowing for effective heat transfer and reduced thermal resistance.
Implementation Method 1
a resin layer composed of a resin composition that includes a thermosetting resin, a curing agent, and an inorganic filler, the curing agent including a benzoxazine derivative
Implementation Method 2
a thermal conductive sheet for transferring the heat to the heat dissipation surface
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
A thermal conductive sheet according to the present invention is a thermal conductive sheet including a resin layer composed of a resin composition that includes a thermosetting resin, a specific curing agent, and an inorganic filler.