Insulating Heat-Dissipation Sheet Surface Roughness for Better Adhesion
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Solution Overview
Problem
The increasing content ratio of inorganic fillers in insulating heat dissipation sheets reduces adhesion between the sheets and adherends, necessitating improved adhesiveness without compromising thermal conductivity.
Innovation Solution
A release sheet-equipped insulating heat dissipation sheet with an inorganic filler and thermosetting resin, featuring a transfer sheet with surface roughness and a positioning sheet, both adhered with a pressure-sensitive adhesive, ensuring strong adhesion to adherends without requiring excessive heat curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the content ratio of inorganic filler in the insulating heat dissipation sheet is increased to enhance thermal conductivity, then heat dissipation properties are improved, but adhesion between the insulating heat dissipation sheet and the adherend is lowered
Solution Approach 1:
The release sheet is segmented into multiple functional layers: a transfer sheet with specific surface roughness (Ra 0.3-1.5 μm) that contacts the insulating heat dissipation sheet, and a positioning sheet with larger area for positioning. This segmentation allows each layer to perform its specific function - the transfer sheet maintains adhesion while the positioning sheet provides positioning stability.
Solution Approach 2:
Different regions of the release sheet have different properties: the transfer sheet has controlled surface roughness (Ra 0.3-1.5 μm) optimized for adhesion maintenance, while the positioning sheet has a larger area for positioning functionality. This local differentiation allows the release sheet to simultaneously address both adhesion and positioning requirements.
2Strength
If a release sheet is added to maintain adhesion, then adhesion is improved, but device complexity increases
Solution Approach 1:
The release sheet serves multiple functions simultaneously: it maintains adhesion between the insulating heat dissipation sheet and adherends, provides positioning stability during assembly, and enables easy peeling after bonding. This multi-functionality reduces the need for separate components and simplifies the overall device structure.
Solution Approach 2:
The transfer sheet's specific surface roughness (Ra 0.3-1.5 μm) enables it to self-adhere to the insulating heat dissipation sheet without requiring additional adhesives, while the positioning sheet's larger area automatically provides positioning functionality during assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances adhesiveness between the insulating heat dissipation sheet and adherends, allowing for effective heat dissipation while maintaining thermal conductivity and suppressing adhesive flow during curing.
Implementation Method 1
an adhesive used for adhesion between the transfer sheet and the positioning sheet, the insulating heat dissipation sheet and the transfer sheet respectively having outer edges matching in shape with each other
Implementation Method 2
the transfer sheet having a surface roughness transferred to the insulating heat dissipation sheet
Implementation Method 3
an insulating heat dissipation sheet having enhanced thermal conductivity by a thermosetting resin having an inorganic filler dispersed therein
Data Source
Figure 1~2
AI summary
Provided is a release sheet-equipped insulating heat dissipation sheet including an insulating heat dissipation sheet and a release sheet, wherein the release sheet includes a transfer sheet, a positioning sheet, and an adhesive, the transfer sheet has a surface roughness transferred to the insulating heat dissipation sheet, and the positioning sheet is configured for use in positioning the insulating heat dissipation sheet.