Heat Dissipation Sheet Composition for Gap Filling and Heat Transfer
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Solution Overview
Problem
Highly integrated electronic devices face challenges in efficiently dissipating heat, leading to potential malfunctions due to excessive heat accumulation.
Innovation Solution
A heat dissipation sheet containing a resin binder and inorganic particles, where the inorganic particles include those with a particle diameter of more than 100 μm and an average surface roughness of 0.1 μm to 2.0 μm, enhancing heat transfer and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a heat dissipation sheet with fine particles is used, then the sheet can fill gaps between device members, but the heat dissipation property is insufficient for highly integrated devices
Solution Approach 1:
The patent segments the filler particles into two distinct size categories: fine particles (0.1-100 μm) for filling gaps and large particles (100-1000 μm) for heat dissipation. This segmentation allows each particle size to perform its specific function optimally, resolving the contradiction between gap filling and heat dissipation in highly integrated devices.
Solution Approach 2:
The patent creates a composite thermal adhesive composition by combining resin binder with two types of inorganic filler particles of different sizes. This composite material structure enables the adhesive to simultaneously achieve gap filling capability and high heat dissipation performance, addressing the insufficiency of single-size particle systems.
2Reliability
If the average height Rc of the heat dissipation sheet surface is reduced, then adhesion to device members improves, but heat transfer efficiency decreases
Solution Approach 1:
The patent optimizes the surface roughness parameter (average height Rc) to a specific range (0.01-2.0 μm) that balances adhesion and heat transfer. This parameter optimization ensures sufficient adhesion strength while maintaining adequate thermal contact, resolving the trade-off between adhesion improvement and heat transfer efficiency.
3Reliability
If inorganic particles with particle diameter of more than 100 μm are included, then heat dissipation property improves, but manufacturing precision becomes more difficult
Solution Approach 1:
The patent segments the filler particles into two distinct size categories: fine particles (0.1-100 μm) for filling gaps and large particles (100-1000 μm) for heat dissipation. This segmentation allows each particle size to perform its specific function optimally, resolving the contradiction between gap filling and heat dissipation in highly integrated devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat dissipation sheet effectively transfers heat from devices to heat sinks, preventing overheating and ensuring the reliability of electronic devices.
Implementation Method 1
a method in which the device and the heat sink are adhered to each other using a heat dissipation sheet in order to efficiently transfer heat in the device to the heat sink
Implementation Method 2
a heat dissipation sheet comprising a resin binder and inorganic particles
Data Source
AI summary
An object of the present invention is to provide a heat dissipation sheet having an excellent heat dissipation property and a heat dissipation sheet-attached device in which the heat dissipation sheet is used. The heat dissipation sheet of the present invention contains a resin binder, and inorganic particles, in which the inorganic particles include at least inorganic particles B having a particle diameter of more than 100 μm, and an average height Rc of each of one and the other surfaces of the heat dissipation sheet is 0.1 μm or more and less than 2.0 μm.