Heat-Conductive Sheet Composition for Low-Temperature Hardening
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Solution Overview
Problem
Heat-conductive sheets with a matrix of polyorganosiloxane are not sufficiently hardened at low temperatures, making them difficult to process and prone to deformation during sheet production, which hinders their practical application in electronic devices.
Innovation Solution
Incorporating a material with an alkyl group having 10 or more carbon atoms and a dimethylsiloxane structure, along with a heat-conductive filler, to increase the hardness of the heat-conductive sheet at low temperatures, while maintaining flexibility at room temperature, by adjusting the melting point and using specific compounds like liquid paraffin, ester compounds, and high melting point liquid silicones.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a heat-conductive sheet with a matrix of polyorganosiloxane is used, then heat resistance and long-term reliability are improved, but the sheet is not sufficiently hardened at low temperatures, making it difficult to process and prone to deformation during sheet production
Solution Approach 1:
The patent combines polyorganosiloxane matrix with specific low-temperature hardening agents (having alkyl groups with 10 or more carbon atoms and dimethylsiloxane structures) to create a composite material that maintains the heat resistance and reliability of polyorganosiloxane while adding the ability to harden at low temperatures for improved processability
Solution Approach 2:
The patent modifies the chemical structure parameters of the matrix by incorporating specific low-temperature hardening agents with defined molecular structures (alkyl groups with 10+ carbon atoms and dimethylsiloxane structures), which changes the physical properties to enable hardening at low temperatures while maintaining other desirable properties
2Strength
If the heat-conductive sheet is cooled to harden it for slicing, then hardness at low temperature is improved, but the molded product deforms during slicing, making it difficult to produce sheets in a practical manner
Solution Approach 1:
The patent optimizes the hardening parameters by selecting specific low-temperature hardening agents that achieve sufficient hardness at low temperatures without causing excessive brittleness or deformation, allowing the molded product to be sliced accurately while maintaining dimensional precision
3Ease of operation
If the heat-conductive sheet is made flexible at room temperature, then followability to heating element and heat sink is improved, but the sheet lacks sufficient hardness for practical sheet production
Solution Approach 1:
The patent creates a dynamic material system that adapts its properties to temperature conditions: the sheet remains flexible at room temperature for easy handling and installation, but hardens at low temperatures during the manufacturing process to enable practical sheet production through slicing and other processing operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting heat-conductive sheet is sufficiently hardened in low-temperature environments for improved processability and maintains flexibility at room temperature, enabling effective heat conduction and reliable production.
Implementation Method 1
the material having at least either one of an alkyl group having 10 or more carbon atoms and a dimethylsiloxane structure and also having a melting point of −60° C. to 23° C., thereby increasing a type 00 hardness of the heat-conductive sheet in a case where the heat-conductive sheet is cooled from room temperature to a temperature lower than room temperature
Implementation Method 2
a heat-conductive filler
Data Source
AI summary
A heat-conductive sheet comprising: a matrix formed of polyorganosiloxane; a material to increase hardness in low temperatures, the material having at least either one of an alkyl group having 10 or more carbon atoms and a dimethylsiloxane structure and also having a melting point of −60° C. to 23° C., thereby increasing a type OO hardness of the heat-conductive sheet, as specified in ASTM D2240, in a case where the heat-conductive sheet is cooled from room temperature to a temperature lower than room temperature; and a heat-conductive filler, the heat-conductive sheet having a type OO hardness of 50 or less at 25° C.