Heat Conductive Sheet Composition for Through-Thickness Heat Transfer

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Solution Overview

Problem

Conventional heat conductive sheets with large particle diameters of heat conductive filler materials improve heat conductivity but compromise the strength of the primary sheet, making them difficult to manufacture efficiently.

Innovation Solution

A method of manufacturing heat conductive sheets using a composition of resin and carbon material with a number-based modal diameter of 5 µm to 50 µm, where the carbon material is subjected to a particle size change during the pre-heat conductive sheet forming step, resulting in a sheet with high heat conductivity and improved strength, allowing for efficient production.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If heat conductive filler materials with large particle diameters (200 μm or more) are used, then heat conductivity is improved, but the strength of the primary sheet is reduced

Engineering Contradiction:
Improveheat conductivityVSAvoidprimary sheet strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent changes the particle diameter parameter of the heat conductive filler material from 200 μm or more to 10 μm or more but less than 200 μm. This parameter change resolves the contradiction by finding an optimal range that provides sufficient heat conductivity while maintaining primary sheet strength for efficient manufacturing.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If heat conductive filler materials with large particle diameters (200 μm or more) are used, then heat conductivity is improved, but manufacturing efficiency is reduced

Engineering Contradiction:
Improveheat conductivityVSAvoidmanufacturing efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent changes the particle diameter parameter to resolve the manufacturing efficiency issue. Smaller particles (10 μm or more but less than 200 μm) enable better sheet formation, lamination, and slicing processes, thereby improving productivity while maintaining adequate heat conductivity.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If heat conductive filler materials with large particle diameters (200 μm or more) are used, then thermal resistance at the interface is reduced, but sheet strength is compromised

Engineering Contradiction:
Improvethermal resistance at interfaceVSAvoidsheet strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent optimizes the particle diameter parameter to balance thermal resistance and sheet strength. The selected range (10 μm or more but less than 200 μm) provides adequate interface contact for heat transfer while ensuring the sheet maintains sufficient strength for manufacturing processes.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enables the production of heat conductive sheets with high heat conductivity in the thickness direction (40 W/m·k or more) while maintaining sufficient strength and productivity, facilitating efficient heat transfer between heat sources and radiators.

Implementation Method 1

heat conductive sheet having high flexibility, as well as high heat conductivity... superior heat conductivity in thickness direction because the heat conductive filler materials are oriented in sheet thickness direction

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

Due to the inclusion of resin, the heat conductive sheet of PTL 1 can exert high flexibility

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentEP3343605B1Heat conductive sheet and method of manufacturing the same
Publication Date: 2024.06.12 ZEON CORP
  • EP3343605B1 patent drawing
  • EP3343605B1 patent drawing
  • EP3343605B1 patent drawing

AI summary

Disclosed is a heat conductive sheet which includes strips joined together side-by-side, each strip including a resin and a carbon material having a number-based modal diameter of 5 µm to 50 µm, wherein the heat conductive sheet has heat conductivity in thickness direction of 40 W/m·k or more.