Heat-Shielded Seal Structure for Semiconductor Processing

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Solution Overview

Problem

Existing seal structures in semiconductor processing apparatuses face challenges in preventing heat transmission from heaters to sealing materials, which can lead to overheating and material degradation.

Innovation Solution

A seal structure comprising a metal plate and a resin-based O-ring is used to seal the space between a heated structure and a manifold, where the metal plate is positioned to shield the O-ring from direct heat transmission, and the manifold is cooled to manage heat effectively.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a seal structure uses a resin-based sealing material to seal the space between heated structures, then the sealing function is achieved, but the sealing material is exposed to heat from the heater causing overheating and material degradation

Engineering Contradiction:
Improvesealing functionVSAvoidtemperature of sealing material
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

A metal plate is introduced as an intermediary component between the heater and the resin-based sealing material. The metal plate serves as a heat shield that blocks direct heat transmission to the sealing material, allowing the seal to function reliably without exposing the resin to excessive temperatures that would cause degradation.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The seal structure is segmented into distinct functional zones: a heat-resistant metal plate component that faces the heater, and a resin-based sealing material component that provides the actual seal. This segmentation allows each material to operate within its optimal temperature range, with the metal plate absorbing or reflecting heat away from the temperature-sensitive resin.

Inventive Principle:
Principle #1Segmentation

2Object-affected harmful factors

If the metal plate is positioned close to the heater to block heat, then heat shielding effectiveness increases, but the metal plate itself may overheat and lose structural integrity

Engineering Contradiction:
Improveheat transmission to sealing materialVSAvoidtemperature of metal plate
Core Design Contradiction:
Object-affected harmful factorsVSTemperature

Solution Approach 1:

The metal plate is designed with specific physical parameters including sufficient thickness and appropriate material selection (such as stainless steel or other heat-resistant alloys) to withstand the thermal environment. By optimizing these parameters, the metal plate can block heat transmission to the sealing material while maintaining its own structural integrity and preventing overheating.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively suppresses the heating of the sealing material, preventing overheating and material degradation while maintaining the integrity of the seal.

Implementation Method 1

the metal plate is positioned to shield the O-ring from direct heat transmission

Methodology Applied
Scientific EffectThermal radiation blocking: Thermal Radiation

Implementation Method 2

the space between the first structure and the second structure is sealed by the metal plate and the sealing material

Methodology Applied
Scientific EffectMechanical sealing: Physical Containment

Data Source

PatentUS20230274916A1Seal structure, substrate processing apparatus and method of manufacturing semiconductor device
Publication Date: 2023.08.31 KOKUSAI DENKI KK
  • US20230274916A1 patent drawing
  • US20230274916A1 patent drawing
  • US20230274916A1 patent drawing

AI summary

According to one aspect of the technique of the present disclosure, there is provided a seal structure capable of sealing a space between a first structure heated by a heater and a second structure arranged so as to face the first structure, the seal structure including: a metal plate arranged in contact with the first structure; and a sealing material made of a resin material and arranged in contact with the metal plate and the second structure, wherein the space between the first structure and the second structure is sealed by the metal plate and the sealing material.