Heat Shrink Component With Conductive Lead Heating
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Solution Overview
Problem
Current methods for installing heat shrink components, such as those used in LV, MV, and HV applications, face challenges including prolonged installation times, safety concerns with open flames, and inefficient energy use, as well as limitations in achieving the high temperatures required for shrinking, particularly with existing electrical heating systems.
Innovation Solution
The use of an electrically conductive lead with high conductivity, made of aluminum and/or copper, to heat a heat shrink layer, allowing for efficient heat distribution and reduced installation time by adjusting the cross-sectional area and length of the lead to achieve the necessary temperature for shrinking, thereby overcoming the limitations of conventional resistance heating wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If open flames (gas torches) are used to heat the heat shrink layer, then the required high temperatures for shrinking are achieved, but safety hazards increase and energy efficiency decreases
Solution Approach 1:
The patent replaces the mechanical/chemical heating system (open flames, gas torches) with an electrical heating system. An electrically conductive lead is embedded in the heat shrink layer, converting electrical energy directly into heat through resistive heating. This substitution eliminates open flames and associated safety hazards while maintaining the capability to achieve required shrink temperatures.
Solution Approach 2:
The electrically conductive lead acts as an intermediary element embedded within the heat shrink layer. It serves as a mediator that converts electrical energy into thermal energy internally, distributing heat uniformly throughout the material from within rather than applying external heat sources. This intermediary approach enables safe, controlled, and efficient heating.
2Temperature
If conventional resistance heating wires are used, then heating capability is provided, but installation time is prolonged and energy efficiency is reduced
Solution Approach 1:
The patent changes the electrical parameters of the heating system by using an electrically conductive lead with high conductivity (at least 3×10^7 S/m) and optimized cross-sectional area (0.007-0.05 mm²). These parameter changes enable much faster heating rates compared to conventional resistance wires, reducing installation time to under 20 minutes while maintaining the required shrink temperature.
Solution Approach 2:
The patent employs pulsed or periodic electrical current through the conductive lead, allowing for rapid heating cycles. This periodic action enables the system to quickly reach the required shrink temperature and then maintain it, significantly reducing the total installation time compared to continuous low-power heating with conventional wires.
3Productivity
If the cross-sectional area of the conductive lead is increased to reduce installation time, then heating speed improves, but the amount of material and cost increase
Solution Approach 1:
The patent optimizes the cross-sectional area of the conductive lead to a specific range (0.007-0.05 mm²) that achieves the optimal balance between heating speed and material usage. This parameter optimization allows sufficient current density for rapid heating while minimizing the quantity of expensive conductive material required, making the process both fast and cost-effective.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables faster and more reliable heat shrink component installation, reducing installation time to under 20 minutes, improving safety by eliminating open flames, and using cheaper wire materials while achieving the required high temperatures for heat shrinkage.
Implementation Method 1
an electrically conductive lead with an electrical conductivity of more than 3·10 7 S/m, made of aluminum and/or copper, to heat a heat shrink layer
Implementation Method 2
Heat shrink components in the sense of the present invention relate to articles that are made from material which shrinks from an expanded state into a shrunk state with much smaller dimensions by applying a sufficient amount of heat
Data Source
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AI summary
The present invention relates to a heat shrink component and method of assembling a heat shrink component. The heat shrink component has first dimensions (102A, 104A) in an expanded state and second dimensions (102B, 104B) in a shrunk state, at least one of the first dimensions (102A) being larger than the corresponding second dimension (102B) and said heat shrink component (100, 100A, 100B) comprises a heat shrink layer (108), and at least one heating unit (120) that is arranged in thermal contact to at least a part of said heat shrink layer (108), said heating unit (120) being operable to heat up the heat shrink layer (108) to its heat shrink temperature. The heating unit (120) comprises at least one electrically conductive lead (106, 116) with an electrical conductivity of more than 3-107 S/m and comprises aluminium and/or copper.