Heat sink
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Solution Overview
Problem
Existing fan heat sinks for electronic components rely solely on air flow for heat dissipation, resulting in insufficient heat dissipation efficiency.
Innovation Solution
A heat sink design incorporating a shell body with a channel for coolant fluid flow, a fan, and a thermally-conductive strip that allows coolant fluid to circulate, enhancing heat dissipation by combining air flow with fluid-based heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If only air flow is used for heat dissipation, then the device structure is simple, but the heat dissipation efficiency is insufficient
Solution Approach 1:
The patent combines two heat dissipation methods (air flow and coolant fluid circulation) into a single integrated system. The shell body simultaneously accommodates both the fan for air flow and the channel for coolant circulation, merging multiple heat dissipation functions into one unified structure to achieve superior heat dissipation efficiency while maintaining structural integration.
Solution Approach 2:
The patent introduces a coolant fluid circulation system with inlet and outlet ports, where coolant flows through channels in the shell body to provide liquid-based heat transfer. This hydraulic approach complements the pneumatic air flow system, creating a dual-mode heat dissipation mechanism that overcomes the limitations of air-only cooling.
2Productivity
If coolant fluid circulation is added to enhance heat dissipation, then heat dissipation efficiency is improved, but the device structure becomes more complex
Solution Approach 1:
The shell body serves multiple functions simultaneously: it provides the structural housing for the fan, contains the coolant fluid channels for liquid cooling, and acts as the heat transfer medium carrier. This multi-functionality reduces the need for separate components and minimizes overall structural complexity while achieving enhanced heat dissipation.
Solution Approach 2:
The patent modifies the shell body by incorporating internal channels and ports, transforming it from a simple housing into an active heat exchange component. This parameter change (adding flow paths) enables the shell to participate directly in heat transfer, improving efficiency without requiring entirely separate cooling systems.
3Productivity
If the contact area for heat transfer is increased, then heat dissipation efficiency is improved, but the manufacturing difficulty increases
Solution Approach 1:
The patent extends the heat transfer interface from a single surface to a three-dimensional network of channels within the shell body. By creating internal flow paths that penetrate the shell structure, the contact area between coolant and shell material is dramatically increased without requiring larger external dimensions, thus maintaining manufacturability while enhancing heat transfer efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly improves heat dissipation efficiency by utilizing both air flow and coolant fluid circulation, increasing the contact area for heat transfer and achieving better heat management for electronic components.
Implementation Method 1
the thermally-conductive strip transfers a high temperature to the fan shell 91 or the cover body 92
Implementation Method 2
the coolant fluid flows in the side wall of the shell body. When flowing through the shell body from the coolant fluid inlet and the coolant fluid outlet, the coolant fluid brings heat of the shell body away
Implementation Method 3
the fan 93 axially extracts air from the air inlet 96 of the cover body 92 into the fan shell 91, and then radially pushes the air out from the air outlet 95
Data Source
AI summary
The present disclosure is a heat sink used for an electronic component. The heat sink includes a shell body, a fan, and a thermally-conductive strip. The thermally-conductive strip abuts against the shell body. The shell body has an internal space and a side wall, and a channel is formed in the side wall of the shell body for a coolant fluid to flow. At two ends of the channel, a coolant fluid inlet and a coolant fluid outlet are respectively formed on an outer wall surface of the side wall. In this way, when flowing through the shell body, the coolant fluid brings heat of the shell body away. Therefore, heat dissipation efficiency can be substantially increased.