Heat Sink Adapter Web Structure for Tighter Thermal Coupling
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Solution Overview
Problem
Existing adapter elements for connecting electronic components to heat sink elements have limitations in cooling capacity due to the distance between web elements, which affects the efficiency of heat dissipation.
Innovation Solution
The adapter element features a design with first and second web elements arranged close together, typically less than 350 μm apart, allowing for a larger connection surface and improved heat dissipation by machining methods like sawing, using materials such as copper and ceramics, and bonding techniques like DCB or active soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the distance between web elements is reduced to improve cooling capacity, then heat dissipation efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies parameter changes by optimizing the distance between web elements to a specific range (100-300 μm, preferably 125-200 μm). This quantitative parameter optimization resolves the contradiction by establishing a precise geometric parameter that maximizes cooling efficiency while remaining manufacturable through advanced fabrication techniques.
2Area of stationary object
If the distance between web elements is reduced to increase connection surface area, then cooling capacity is improved, but device complexity increases
Solution Approach 1:
The adapter element is segmented into multiple thin web elements arranged in a comb-like structure. This segmentation increases the total connection surface area between the electronic component and heat sink while maintaining electrical insulation. The segmented design resolves the contradiction by distributing the connection function across multiple discrete elements rather than requiring a single complex structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the cooling efficiency by optimizing the connection surface and heat dissipation capacity, ensuring effective thermal management and simplified component connection processes.
Implementation Method 1
cool electronic components that generate heat during operation by means of a corresponding heat sink element
Implementation Method 2
heat sink elements comprise, for example, one or more channels through which a cooling liquid is transported
Implementation Method 3
the adapter element primarily serving to electrically insulate the first connection region from the second connection region
Implementation Method 4
adapter elements are manufactured by bonding a first metal layer to an insulation layer
Data Source
AI summary
An adapter element (10) for connecting an electronic component (30) to a heat sink element (20), including an insulation layer (15) extending along a main extension plane (HSE), and at least a first web element (11) and a second web element (12), which are arranged next to each other in a direction parallel to the main extension plane (HSE), forming a free area (13), which, in the assembled state, are arranged between the insulating layer (15) and the electronic component (30) in a direction running perpendicular to the main extension plane (HSE), and on whose front sides (18) facing away from the insulating layer (15) the electronic component (30) is arranged in the assembled state, wherein a distance (A) between the first web element (11) and the second web element (12), measured in a plane parallel to the main extension plane (HSE), is smaller than 350 μm.