Heat Sink Adhesive Pattern for Secure Semiconductor Attachment
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Solution Overview
Problem
The challenge in semiconductor devices with heat sinks is the difficulty in firmly attaching and positioning the heat sink due to reduced substrate area from passive components, leading to potential detachment under external forces or adhesive damage, which is exacerbated by the use of larger heat sinks.
Innovation Solution
A semiconductor device with a base material featuring heat sink mounting areas and an adhesive layer forming a tapered pattern to reduce stress and adhesive use, allowing the heat sink to be securely attached without altering its shape or size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large heat sink is used to cover and bond to the chip for effective heat dissipation, then heat dissipation performance is improved, but the heat sink becomes difficult to firmly attach and position on the substrate due to reduced substrate area from passive components
Solution Approach 1:
The adhesive layer is designed with non-uniform thickness, featuring a first thickness at the center of the heat sink mounting area and a second thickness at the periphery, where the first thickness is greater than the second thickness. This local quality variation allows the adhesive to provide stronger bonding force where needed (center) while accommodating the reduced substrate area and passive components at the periphery, thereby securing the large heat sink firmly to the substrate.
2Adaptability or versatility
If the substrate area is reduced by disposing passive components, then functional integration is improved, but the heat sink attachment reliability deteriorates due to insufficient bonding area
Solution Approach 1:
The adhesive layer thickness is locally optimized with a greater first thickness at the center and a smaller second thickness at the periphery. This local quality approach concentrates the bonding strength where the heat sink requires it most, compensating for the reduced overall bonding area caused by passive components, thereby maintaining attachment reliability while preserving functional integration.
Solution Approach 2:
The adhesive layer parameters (thickness distribution) are changed from uniform to non-uniform, with the first thickness at the center being greater than the second thickness at the periphery. This parameter change optimizes the bonding characteristics to accommodate the reduced substrate area while ensuring sufficient attachment reliability for the heat sink.
3Ease of manufacture
If the adhesive layer uses uniform thickness for bonding the heat sink, then manufacturing simplicity is maintained, but stress distribution is uneven leading to potential delamination under external forces
Solution Approach 1:
The adhesive layer is designed with non-uniform thickness, featuring a first thickness at the center and a second thickness at the periphery. This local quality variation creates more uniform stress distribution across the adhesive layer, preventing stress concentration that would lead to delamination under external forces such as vibration or collision, while still maintaining reasonable manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tapered adhesive pattern effectively reduces stress and adhesive usage, enhancing reliability and cost-effectiveness while maintaining the heat sink's attachment, without requiring new processes or materials, thus meeting end product requirements.
Implementation Method 1
an adhesive layer disposed on the heat sink mounting areas, wherein the adhesive layer at at least one side forms a first pattern
Data Source
AI summary
A semiconductor device with a heat sink is provided, in which a base material is rectangular and provided with heat sink mounting areas at four sides of the base material. An adhesive layer is disposed on the heat sink mounting areas, and the adhesive layer at at least one side forms a first pattern, where a width of the first pattern is tapered from both ends of the side toward a center of the side, and the heat sink is mounted on the base material via the adhesive layer.