Heat Sink Connecting Assembly for Shear-Resistant Device Alignment
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Solution Overview
Problem
Existing electronic apparatuses face challenges in providing a tight and firm aligning connection between detachable devices, which affects the reliability of the electronic apparatuses.
Innovation Solution
A connecting assembly is introduced, comprising a first connecting component with heat dissipating fins and a second connecting component with cooperating heat dissipating fins, along with a pin that aligns and secures the devices. The engaging and cooperating engaging portions on the fins provide support to the pin, reducing shear forces and ensuring proper alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a pin is used to connect two detachable devices, then the connection is simple and easy to manufacture, but the pin is susceptible to shear force damage and the connection reliability is insufficient
Solution Approach 1:
The connection structure is segmented into multiple components: the pin, engaging portions on heat dissipating fins, and cooperating engaging portions. This segmentation distributes the shear force from the pin across multiple engagement points, reducing the stress on any single component while maintaining manufacturing simplicity.
Solution Approach 2:
The engaging portions and cooperating engaging portions extend the connection functionality from a single-point pin connection to a multi-point distributed connection. By adding engagement points in different spatial dimensions (along the heat dissipating fins), the structure enhances reliability without significantly complicating the manufacturing process.
2Reliability
If multiple heat dissipating fins are used with engaging portions, then the connection reliability is improved, but the device complexity increases
Solution Approach 1:
The heat dissipating fins serve dual functions: thermal management (heat dissipation) and mechanical connection (providing engaging portions). This multi-functionality allows the structure to enhance connection reliability without adding separate alignment components, thereby avoiding increased device complexity.
Solution Approach 2:
The engaging portions are merged with the heat dissipating fins rather than being separate components. This integration combines the thermal management function with the alignment connection function, achieving improved reliability while maintaining a compact and relatively simple overall structure.
Data Source
AI summary
A connecting assembly for providing an aligning connection between a first electronic device and a second electronic device includes a first connecting component disposed on the first electronic device, a plurality of first heat dissipating fins disposed on the first connecting component, a second connecting component disposed on the second electronic device, a plurality of second heat dissipating fins disposed on the second connecting component, and a pin. An engaging portion is formed on one of the first heat dissipating fins. A cooperating engaging portion is formed on one of the second heat dissipating fins. The pin protrudes from the first connecting component and for being inserted into the second connecting component. The engaging portion is for abutting against the cooperating engaging portion along a direction perpendicular to an inserting direction of the pin. Besides, a related electronic apparatus is also provided.