Heat Sink Angular Mounting for LED Strip Thermal Paste Application
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Solution Overview
Problem
Existing heat sink configurations for electronic components face challenges in evenly applying thermal paste and ensuring complete coverage, leading to inefficient heat dissipation and potential damage during mounting.
Innovation Solution
A heat sink with a channel-shaped mounting formation that allows for angular and transverse displacement of the electronic unit, facilitating even thermal paste application and secure mounting, thereby improving heat dissipation and reducing component damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal paste is applied between the PCB and heat sink to improve heat dissipation, then heat transfer efficiency is improved, but it becomes difficult to apply thermal paste evenly and ensure complete coverage when sliding the PCB into the heat sink
Solution Approach 1:
The patent applies thermal paste to the mounting surface of the heat sink before mounting the PCB, rather than attempting to apply it during the sliding insertion process. This preliminary application allows for controlled, even distribution of thermal paste across the entire mounting surface, ensuring complete coverage and eliminating air gaps while avoiding the difficulties of applying paste during dynamic insertion.
2Ease of operation
If the PCB is slid into the heat sink along its length for mounting, then assembly is simplified, but thermal paste application becomes uneven and coverage is incomplete
Solution Approach 1:
The patent performs thermal paste application as a preliminary step before the sliding insertion operation. The paste is applied to the stationary heat sink mounting surface, allowing for precise, uniform coverage. The PCB is then slid into position, maintaining the evenly distributed paste layer without disturbing it, thus achieving both ease of assembly and manufacturing precision.
3Device complexity
If a conventional heat sink mounting structure is used, then the structure is simple, but it causes damage to electronic components during mounting
Solution Approach 1:
The patent applies thermal paste to the heat sink mounting surface before inserting the PCB, ensuring that the paste is already in position to fill gaps and protect components during the insertion process. This preliminary preparation prevents component damage by ensuring proper thermal contact from the start, avoiding the need for forceful adjustments during assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables easier and more even application of thermal paste, ensuring effective heat dissipation and reducing the risk of damage to electronic components during assembly.
Implementation Method 1
A heat sink transfers heat from electronic components to a fluid medium (e.g. air), where it is dissipated away from the electronic components
Implementation Method 2
A heat sink transfers heat from electronic components to a fluid medium (e.g. air), where it is dissipated away from the electronic components
Implementation Method 3
a thermal paste (also known as a heat paste or 'thermal grease') is typically applied between the PCB and the heat sink to which it is mounted, to serve as an interface between the PCB and heat sink, facilitating the dissipation of heat away from the PCB
Data Source
AI summary
The invention relates to a heat sink (10, 60, 120, 150) having a body (12) which includes a channel-shaped mounting formation configured to hold an electronic unit (40) in the form of an LED strip captive therein. The channel-shaped mounting formation defines has a slot which includes a mouth (22) having a transverse width which is less than a width of the electronic unit (40), and a nook (30) which is configured to permit mounting of the electronic unit (40) to the heat sink by passing the electronic unit through the mouth (22) and angularly displacing the electronic unit (40) relative to the mounting formation of the body (12). Instead of sliding the LED strip into the slot, which could damage the strip or result in poor application of thermal paste, the strip is mounted by applying paste and angularly and transversely displacing the strip relative to the body.