Heat Sink Backplate Module for Circuit Board Thermal Management
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Solution Overview
Problem
High-temperature issues on the bottom of circuit boards due to heat conduction from heat sources, which can lead to motherboard deformation and malfunction, are not adequately addressed by existing heat sink solutions.
Innovation Solution
A heat sink backplate module with a body, heat pipes, fins assembly, and heat spreaders is used to dissipate heat from the bottom of the circuit board, incorporating fixing elements like resilient clout nails or spring screws for secure attachment, and optional second heat spreaders for enhanced heat transfer to the case for external dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the size and weight of the heat sink are increased to satisfy heat dissipation demand, then heat dissipation efficiency is improved, but the motherboard may deform due to gravity force
Solution Approach 1:
The backplate is designed to counterbalance the gravitational force of the heat sink by providing structural support from the opposite side. This anti-weight approach prevents motherboard deformation while allowing the heat sink to maintain its necessary size and weight for effective heat dissipation.
Solution Approach 2:
The backplate serves multiple functions: it provides structural support to prevent motherboard deformation, acts as a mounting surface for the heat sink, and incorporates heat dissipation components (heat spreader and heat pipe) to actively manage thermal issues. This multi-functionality resolves the conflict between structural support and heat dissipation requirements.
2Strength
If a heat sink backplate is assembled to improve structure strength and firmly dispose the heat sink, then structural integrity is improved, but heat conduction to the bottom of the motherboard still occurs
Solution Approach 1:
The heat spreader and heat pipe act as intermediary thermal management components integrated into the backplate. These intermediaries actively intercept and conduct heat away from the bottom of the motherboard before it can cause overheating, while the backplate simultaneously provides the necessary structural support.
Solution Approach 2:
The heat dissipation function is extracted from the traditional heat sink-only approach and distributed to multiple components: the heat sink for top-surface cooling, and the heat spreader with heat pipe for bottom-surface cooling. This extraction allows the backplate to simultaneously provide structural support and active heat management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the bottom temperature of the circuit board through efficient heat conduction and convection, improving structural integrity and ensuring normal operation of electronic components while dissipating heat externally.
Implementation Method 1
one end of the heat pipe is passed through the body, and the fins assembly is disposed on the other end of the heat pipe
Implementation Method 2
The first heat spreader is disposed on a surface of the body and is suitable close to the circuit board
Implementation Method 3
the fins assembly is disposed on the other end of the heat pipe
Data Source
AI summary
An electronic apparatus includes a case, a circuit board disposed in the case, a heat sink backplate module, and a heat sink disposed on a heat source of the circuit board. The heat sink backplate module is disposed on a surface of the circuit board opposite to the heat source. The heat sink backplate module includes a body having a plurality of holes, at least a heat pipe, a fins assembly, and a heat spreader. The pluralities of fixing elements of the heat sink are fixed in the holes such that the heat sink is disposed firmly on the heat source. The heat spreader is disposed on a surface close to the circuit board. The heat pipe passing through the body is suitable for heat conducting from the bottom of the circuit board to the fins assembly so that the temperature of the bottom of the circuit board is decreased.