Heat Sink Air Baffle Mounting to Prevent Cooling Air Leakage

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Solution Overview

Problem

Conventional air baffles in heat dissipating assemblies require additional metal hooking structures for installation, which is time-consuming and costly, and often result in imprecise fitting leading to airflow leakage.

Innovation Solution

The heat dissipating assembly incorporates a heat sink and air baffle design where the air baffle shares fasteners with the heat sink for installation, eliminating the need for additional screws or metal hooking structures and ensuring precise positioning to prevent leakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If additional metal hooking structures are used to install the air baffle, then the air baffle can be securely mounted, but the assembly process becomes time-consuming and costly

Engineering Contradiction:
Improvesecure mounting of air baffleVSAvoidassembly time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent combines the air baffle installation with the heat sink installation by using the same fasteners (screws) for both components. The fasteners pass through both the heat sink and air baffle simultaneously, eliminating the need for separate installation steps and additional hooking structures, thereby reducing assembly time while maintaining secure mounting.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The fasteners serve multiple functions: they secure both the heat sink and the air baffle to the circuit board, and they align both components during installation. This multi-functionality eliminates the need for dedicated hooking structures for the air baffle, reducing both assembly time and component complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If additional metal hooking structures are used to install the air baffle, then the air baffle can be securely mounted, but the manufacturing cost increases

Engineering Contradiction:
Improvesecure mounting of air baffleVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the installation of the air baffle with the heat sink installation process, using the same fasteners for both components. This eliminates the need for additional metal hooking structures, reducing material costs and simplifying the manufacturing process while ensuring secure mounting of the air baffle.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The fasteners are designed to perform multiple functions: securing both the heat sink and air baffle, and providing alignment features. This multi-functionality reduces the total number of components needed, lowering manufacturing costs while maintaining reliable mounting of the air baffle.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of operation

If the air baffle is disposed on the heat sink with structure configuration, then installation is simplified, but it creates large gaps to the heat sink resulting in leakage of cooling air

Engineering Contradiction:
Improveinstallation simplicityVSAvoidairflow sealing
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent replaces the mechanical interference fit or gap-tolerant structure with a fastener-based system that provides precise positioning and secure attachment. The fasteners ensure the air baffle is firmly mounted to the heat sink, eliminating gaps and preventing cooling air leakage while maintaining installation simplicity through the combined installation process.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Reliability

If separate fasteners are used for heat sink and air baffle installation, then each component can be securely mounted, but the assembly process becomes more complex

Engineering Contradiction:
Improvesecure mounting of componentsVSAvoidassembly process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the mounting of the heat sink and air baffle into a single operation using the same fasteners. The fasteners pass through both components simultaneously, securing them to the circuit board in one step, thereby reducing assembly process complexity while maintaining secure mounting of both components.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The fasteners are designed to serve multiple purposes: securing both the heat sink and air baffle, and providing alignment features for both components. This multi-functionality reduces the total number of installation steps and components needed, simplifying the assembly process while ensuring reliable mounting of all components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design simplifies the assembly process, reduces costs, and prevents airflow leakage by using the same fasteners for both components, allowing for precise installation and combined installation processes.

Implementation Method 1

the base plate can be in direct thermal contact with the heat source and transfer heat absorbed from the heat sources to the fins

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

uses air as a medium to take away heat from electronic elements

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

The air baffle is disposed on the heat sink to help guiding airflow more directly to flow through the heat sink

Methodology Applied
Scientific EffectAirflow guidance:

Data Source

PatentUS12108578B2Heat dissipating assembly and electronic assembly and electronic device including the same
Publication Date: 2024.10.01 WISTRON CORP
  • US12108578B2 patent drawing
  • US12108578B2 patent drawing
  • US12108578B2 patent drawing

AI summary

A heat dissipating assembly including a heat sink and an air baffle, the heat sink includes a base portion, a heatsink portion, installation channels, and first installation hole portions, the base portion is stackable on an electronic component, the heatsink portion comprises fins extend outwardly from the base portion, the first installation hole portions are located on the base portion and respectively correspond to the installation channels, the air baffle is disposed on the heatsink portion and includes a second installation hole portion, the second installation hole portion selectively corresponds to one of the installation channels and one of the first installation hole portions.