Heat Sink Bonding Structure for Semiconductor Module Heat Dissipation
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Solution Overview
Problem
Conventional electronic devices face a trade-off between the heat dissipation and joining functions of thermally-conductive bonding materials, leading to reduced reliability due to stress in the bonding material, which affects the heat transfer and joining performance.
Innovation Solution
The introduction of protrusions and recesses in the joined surface portions of the heat sink and heat dissipation plate, with varying thicknesses of the thermally-conductive bonding material, enhances both the heat dissipation and joining functions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the film thickness of the thermally-conductive bonding material is thickened to relax stress, then the joining function is enhanced, but the heat dissipation function decreases
Solution Approach 1:
The bonding material is designed with spatially varying thickness: thicker regions (second thickness) are positioned at stress-prone peripheral areas to enhance joining strength and stress relaxation, while thinner regions (first thickness) are positioned at heat-generate areas to minimize thermal resistance and improve heat dissipation. This local differentiation resolves the contradiction by optimizing each region's thickness according to its specific functional requirements.
2Temperature
If the film thickness of the thermally-conductive bonding material is reduced to improve heat dissipation, then the heat dissipation function is enhanced, but the joining function decreases
Solution Approach 1:
The bonding material thickness is locally optimized: thinner regions (first thickness) are positioned at heat-generate areas to minimize thermal resistance and improve heat dissipation, while thicker regions (second thickness) are positioned at stress-prone peripheral areas to enhance joining strength. This local differentiation resolves the contradiction by allowing heat dissipation optimization where needed without compromising overall joining integrity.
3Ease of manufacture
If the thermally-conductive bonding material has uniform thickness, then the manufacturing process is simplified, but both heat dissipation and joining functions cannot be optimized simultaneously
Solution Approach 1:
The bonding material is designed with at least two different thicknesses (first thickness and second thickness) positioned in different regions. This local differentiation allows simultaneous optimization of heat dissipation (thinner regions) and joining strength (thicker regions), resolving the contradiction between manufacturing simplicity and overall performance by achieving better reliability through targeted thickness variation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the reliability and heat dissipation properties of electronic devices by optimizing the bonding material's stress distribution and performance.
Implementation Method 1
the thermally-conductive bonding material is required to have a heat dissipation function (a heat transfer function) to dissipate (transfer) heat generated in the semiconductor module to the heat sink
Data Source
AI summary
The electronic device includes a semiconductor module provided on a heat sink including a first joined surface portion. The semiconductor module includes a heat dissipation plate including a second joined surface portion joined to the first joined surface portion via a thermally-conductive bonding material, and a transistor chip placed on a side of the heat dissipation plate which is opposite to the second joined surface portion. At least one joined surface portion out of the first joined surface portion and the second joined surface portion includes a plurality of protrusions protruding toward the other joined surface portion out of the first joined surface portion and the second joined surface portion, a first recess placed between the protrusions and recessed in a direction away from the other joined surface portion, and a second recess placed outward of the plurality of protrusions and recessed in a direction away from the other joined surface portion. A thickness at the first recess of the thermally-conductive bonding material is greater than a thickness at the protrusions thereof, and a thickness at the second recess of the thermally-conductive bonding material is greater than the thickness at the first recess.