Heat Sink Bracket Assembly for Low-Resistance Module Cooling
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Solution Overview
Problem
Existing heat dissipation technologies for swappable electronic components, such as optical modules, suffer from high thermal resistance, poor heat dissipation efficiency, and inconvenient insertion and removal due to unstable contact pressure and large friction forces.
Innovation Solution
A heat dissipation apparatus with a bracket assembly, heat sink, and fastening assemblies, featuring guide grooves and fastening members that guide the heat sink to obliquely engage with the component, reducing sliding friction and ensuring stable contact through inclined guide grooves and mating connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large-sized heat dissipation fin array is used to improve heat dissipation performance, then heat dissipation efficiency is improved, but the device size and complexity increase
Solution Approach 1:
The patent implements a nested structure where the first heat dissipation fin array and second heat dissipation fin array are arranged in different spatial layers, with the third heat dissipation fin array positioned between corresponding fins of the first and second arrays. This nested arrangement maximizes heat dissipation surface area within a compact vertical space, improving heat dissipation performance without proportionally increasing device footprint.
Solution Approach 2:
The patent transitions from a single-plane fin array to a three-dimensional multi-layer fin structure. The first and second heat dissipation fin arrays are arranged in different spatial layers, utilizing the vertical dimension to increase total heat dissipation surface area. This dimensional expansion allows higher heat dissipation capacity while maintaining a compact overall device size.
2Temperature
If heat dissipation fin arrays are arranged close together to improve heat dissipation efficiency, then heat dissipation performance is improved, but airflow passage becomes blocked
Solution Approach 1:
The patent divides the heat dissipation fin structure into multiple segmented arrays (first, second, and third heat dissipation fin arrays) arranged in different spatial layers. The airflow passage is correspondingly segmented into multiple channels, allowing air to flow through distinct pathways. This segmentation enables closely spaced fins to maintain high heat dissipation efficiency while preserving adequate airflow channels to prevent blocking and maintain airflow velocity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively reduces thermal contact resistance, enhances heat transfer performance, and facilitates labor-saving insertion and removal of swappable components by ensuring stable and controllable pressure during the process.
Implementation Method 1
a fan, configured to drive air to blow the heat dissipation fin arrays
Implementation Method 2
a heat dissipation apparatus... configured to hold the semiconductor device and the heat dissipation fin arrays
Data Source
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AI summary
This application relates to the field of heat dissipation technologies, and in particular, to a heat dissipation apparatus and an electronic device. The heat dissipation apparatus includes: a bracket assembly, where the bracket assembly includes an accommodation portion, a first opening, and a second opening, and the accommodation portion is used for accommodating a heat source component; a heat sink, where a heat conducting protrusion is disposed on a first surface of the heat sink, and the heat conducting protrusion extends into the accommodation portion through the second opening; and guide grooves are respectively provided in two side surfaces of the heat sink, and an extension direction of the guide grooves is inclined toward the first surface in an insertion direction of the heat source component; and fastening assemblies, each including a connecting member and a pressing member, where the pressing members are disposed on two sides of the bracket assembly, one end of the connecting member is slidably assembled in a guide groove located on a same side, and the other end of the connecting member abuts against a pressing member located on a same side. In this application, thermal contact resistance of the heat sink and the heat source component can be reduced, heat transfer performance between the heat sink and the heat source component can be improved, heat dissipation of the heat source component can be more effective, and it is convenient and labor-saving to insert or remove the heat source component.