Heat Sink Cover Deflects Capacitor Electrolyte
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Solution Overview
Problem
In downsized image forming apparatuses, the short distance between the exterior surface and circuit board poses a risk of electrolytic solution from the explosion-proof valve of the electrolytic capacitor adhering to circuitry, leading to potential short circuits, as existing deflection plate configurations are insufficient due to space constraints.
Innovation Solution
The electrolytic capacitor is positioned on a board with its surface opposite to the explosion-proof valve facing the board, and a heat sink with a protruding portion and cover portion, featuring a hole that prevents the electrolytic solution from adhering to the circuitry by directing it away from the primary circuitry, enhancing heat dissipation and preventing solution adherence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a deflection plate is provided to guide electrolytic solution away from primary circuitry, then circuit reliability is improved, but device size increases and space requirements are not met
Solution Approach 1:
The patent combines the deflection plate function with the heat sink structure. The heat sink's protruding portion and cover portion are configured to serve both heat dissipation and electrolytic solution deflection purposes, eliminating the need for a separate deflection plate and reducing overall device volume.
Solution Approach 2:
The heat sink is designed to perform multiple functions: it dissipates heat from power supply components and simultaneously acts as a deflection plate to guide electrolytic solution away from primary circuitry. This multi-functionality resolves the space constraint issue while maintaining both thermal management and circuit protection.
2Volume of moving object
If the distance between exterior surface and circuit board is reduced for downsizing, then device compactness is improved, but electrolytic solution may adhere to circuitry causing short circuits
Solution Approach 1:
The heat sink's cover portion acts as an intermediary structure between the electrolytic capacitor and the circuit board. It physically blocks and redirects the electrolytic solution jet, preventing direct contact with the circuit board even when the device is downsized and components are placed closer together.
Solution Approach 2:
The solution addresses the two-dimensional space constraint by utilizing the third dimension (vertical height). The protruding portion and cover portion extend upward from the circuit board, creating a three-dimensional protective structure that deflects electrolytic solution away from the board without increasing the horizontal footprint.
3Volume of moving object
If deflection plate is provided close to electrolytic capacitor for space saving, then device size is reduced, but sufficient deflection protection cannot be provided
Solution Approach 1:
The heat sink's cover portion is designed with specific geometric features (protruding portion, cover portion with hole) that dynamically interact with the electrolytic solution jet. The structure is positioned and shaped to effectively intercept and redirect the solution flow, providing sufficient protection even in compact configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the adherence of electrolytic solution to circuitry while enabling the downsizing of image forming apparatuses by ensuring the solution is directed away from critical components, maintaining circuit functionality and improving heat dissipation.
Implementation Method 1
a heat sink configured to dissipate heat from the power supply apparatus
Data Source
AI summary
A power supply apparatus includes a transformer, an electrolytic capacitor provided in primary circuitry of the transformer, a board, and a heat sink having a protruding portion and a cover portion. The electrolytic capacitor includes an explosion-proof valve that opens to cause an electrolytic solution to be jetted from the electrolytic capacitor. The electrolytic capacitor is placed on the board so that a surface of the electrolytic capacitor opposite to a surface on which the explosion-proof valve is provided faces the board. The cover portion has a hole formed in the cover portion and, when the cover portion is viewed in a direction vertical to the surface of the electrolytic capacitor on which the explosion-proof valve is provided, at least the explosion-proof valve and the hole formed in the cover portion do not overlap each other and the cover portion encompasses the explosion-proof valve.