Heat Sink Capacitor Integration for Lower-Loss Power Converters
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Solution Overview
Problem
Power electronic converters face inefficiencies due to passive components like DC-link capacitors and common mode filters, which contribute to weight, volume, and power losses, and thermal management challenges, necessitating a solution that integrates thermal and electrical components.
Innovation Solution
The integration of a heat sink capacitor that combines thermal and electrical functions, using conductive bus plates with dielectric materials like BaTiO3, eliminating the need for separate thermal interface materials and reducing parasitic capacitance, thereby acting as a DC-link capacitor and simplifying the converter design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If separate thermal interface materials are used to join electronic devices to heat sinks, then thermal transfer is enabled, but thermal resistance increases and contact resistance (air gap) occurs between the baseplate and TIM
Solution Approach 1:
The patent merges the thermal interface material function directly into the heat sink baseplate structure, eliminating the separate TIM layer and its associated contact resistance. The baseplate itself provides the thermal transfer pathway, removing the air gap interface between heat sink and electronic device.
Solution Approach 2:
The heat sink baseplate performs multiple functions: it provides structural support, electrical insulation, and thermal transfer pathways. By integrating these functions into a single component, the patent eliminates the need for separate thermal interface materials and reduces overall thermal resistance.
2Reliability
If passive components like DC-link capacitors and common mode filters are used in power converters, then electrical decoupling and EMI suppression are achieved, but weight, volume, and power losses increase
Solution Approach 1:
The patent combines the DC-link capacitor and common mode filter functions into the heat sink structure itself. The heat sink serves dual purposes: thermal management and electrical decoupling/EMI suppression, thereby reducing the overall weight and volume of the power converter system.
Solution Approach 2:
The heat sink is designed to perform multiple functions simultaneously: it provides thermal pathways for heat dissipation, electrical insulation for safety, capacitive decoupling for power stability, and EMI filtering for electromagnetic compatibility. This multi-functionality eliminates the need for separate passive components.
3Reliability
If multiple separate components are used for thermal management and electrical functions, then each function is performed adequately, but device complexity increases
Solution Approach 1:
The patent integrates thermal management components (heat sink, thermal pathways) and electrical components (capacitor, filter, insulation) into a single unified structure. This consolidation reduces the number of discrete parts, simplifies assembly, and lowers overall system complexity while maintaining all required functions.
Solution Approach 2:
The heat sink structure is designed as a multi-functional component that simultaneously provides thermal conduction, electrical insulation, capacitive energy storage, and EMI filtering. This universal design approach eliminates the need for multiple separate components and their associated mounting and connection complexities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the complexity and weight of power converters, enhances thermal performance, and eliminates the need for additional filters, leading to increased efficiency and reduced power losses, while maintaining compliance with EMI standards.
Implementation Method 1
a first dielectric material electrically insulates the P bus from the first side of the heat sink and the portion of the heat sink that separates the first dielectric material and the second dielectric material to form a first capacitor
Implementation Method 2
the power electronics cooling system may be responsible for about a third of the total converter weight, and multiple thermal resistances present between the hot spot and the cooling medium often inhibit the thermal performance
Data Source
AI summary
The disclosure relates to capacitive heatsink devices and systems. In one embodiment, the heat sink capacitor includes a positive (P) bus plate; a negative (N) bus plate; a first dielectric material; a second dielectric material; and a heat sink comprising a first side and a second side, the first side of the heat sink attached to the first dielectric material and the second dielectric material, wherein the first dielectric material and the second dielectric material are separated by a portion of the heat sink, wherein the first dielectric material electrically insulates the P bus plate from the first side of the heat sink to form a first capacitor, and wherein the second dielectric material electrically insulates the N bus plate from the first side of the heat sink to form a second capacitor.