Semiconductor Heat Sink Fin Layout for Central Cooling
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Solution Overview
Problem
The existing heat sink for semiconductor devices lacks fins in the central area, resulting in inadequate cooling of the central part of the semiconductor device, which hinders the reduction of its temperature.
Innovation Solution
A heat sink design featuring a coolant flow path with first and second plates, partition walls, and fins, where the fins and partition walls are arranged to coincide with the central part of the semiconductor device, enhancing heat transfer and cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If fins are arranged in parallel rows on the back side of the base plate as in conventional heat sinks, then the manufacturing is simple and structure is straightforward, but the central part of the semiconductor device is insufficiently cooled because no fins are positioned over the central heat-generating area
Solution Approach 1:
The heat sink applies local quality by positioning fins specifically over the central heat-generating area of the semiconductor device rather than uniformly distributing them. The fin arrangement is optimized locally where heat generation is highest, with fins extending from the front surface through the base plate to the back surface, creating enhanced heat dissipation precisely where needed in the central region.
Solution Approach 2:
The invention transitions from a conventional two-dimensional fin arrangement on the back surface to a three-dimensional structure where fins penetrate through the base plate from front to back surfaces. This dimensional change allows fins to be positioned both vertically through the base plate and horizontally over the central area, enabling heat extraction from the central region that was previously inaccessible.
2Loss of energy
If the coolant nozzle is positioned to coincide with the central part of the semiconductor device, then the coolant delivery is optimized, but heat transfer from the central part to the coolant remains insufficient due to lack of fins in that region
Solution Approach 1:
The heat sink applies local quality by positioning fins specifically over the central heat-generating area of the semiconductor device rather than uniformly distributing them. The fin arrangement is optimized locally where heat generation is highest, with fins extending from the front surface through the base plate to the back surface, creating enhanced heat dissipation precisely where needed in the central region.
Solution Approach 2:
The invention merges the coolant delivery system with the fin structure by positioning the coolant nozzle to coincide with the central fin arrangement. This integration ensures that coolant is delivered directly to the region where fins are most densely concentrated, maximizing the heat transfer interface between coolant and fins at the hottest location of the semiconductor device.
3Productivity
If fins are added to cover the central part of the semiconductor device, then cooling efficiency improves, but the device complexity and structural design become more complicated
Solution Approach 1:
The heat sink applies segmentation by dividing the fin structure into distinct regions: fins positioned over the central heat-generating area and fins positioned over the peripheral areas. This segmentation allows optimization of fin density and arrangement in the central region without compromising the overall structural integrity or manufacturing feasibility of the complete heat sink assembly.
Solution Approach 2:
The heat sink base plate serves multiple functions: it provides structural support, conducts heat from the semiconductor device to the fins, and acts as a mounting surface for both the fins and the coolant nozzle. This multi-functionality reduces the need for additional components, maintaining manufacturing simplicity while achieving enhanced central region cooling through the integrated fin-base plate-nozzle assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces the temperature of the central part of the semiconductor device by improving heat transfer to the coolant, thus enhancing cooling efficiency.
Implementation Method 1
a plurality of first fins provided in contact with the second surface of the first plate
Implementation Method 2
a coolant flow path formed inside through which a coolant to cool an object to be cooled flows
Data Source
AI summary
A heat sink having a coolant flow path formed inside through which a coolant flows includes: a heat transfer plate having a first surface on which a semiconductor device is disposed and a second surface; a junction flow path-forming plate having a third surface and a fourth surface; a first partition wall provided in contact with the second surface and the third surface; and first fins provided in contact with the second surface. The coolant flow path includes a first flow path. A plurality of first divided regions separated by the at least one first partition wall are formed in the first flow path. The plurality of first fins are arranged by being spaced side by side in the first divided regions.