Heat Sink Clasp Structure for Easy PCB Assembly
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Solution Overview
Problem
Existing heat dissipating devices for electronic components are difficult to disassemble and assemble, and their manufacturing costs are high due to complex clasp mechanisms that do not allow direct fixation to the components.
Innovation Solution
A heat dissipating device combined structure featuring a heat sink with extended fins and expanded portions, and a clasp member with slanting and ledge portions that facilitate easy assembly and disassembly, while providing stable fastening and reducing manufacturing costs by allowing the circuit board to be securely positioned between the heat sink and clasp member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a complex clasp member with eccentric wheel and spring arm is used to fix the heat sink to the circuit board, then the fastening stability is improved, but the ease of operation for disassembly and assembly deteriorates
Solution Approach 1:
The clasp member is divided into multiple functional segments: a base portion providing structural support, clasp portions with slanting surfaces for engagement, and air foils for heat dissipation. This segmentation allows each part to perform its specific function efficiently while simplifying the overall assembly process compared to the integrated eccentric wheel mechanism.
Solution Approach 2:
Instead of using a complex mechanism that requires rotational motion and spring force to achieve fastening, the invention inverts the approach by using simple geometric features (slanting portions and expanded portions) that engage through direct linear insertion. The circuit board itself becomes part of the fastening mechanism by being夹持 between the clasp portions and the heat sink bottom portion.
2Reliability
If a complex clasp member with multiple components (first fastening member, second fastening member, handle, eccentric wheel) is used, then the fastening stability is improved, but the device complexity increases
Solution Approach 1:
The invention merges the functions of multiple components into a single integrated clasp member. The base portion, clasp portions, and air foils are combined into one piece, eliminating the need for separate first fastening member, second fastening member, handle, and eccentric wheel components. This reduces part count and assembly complexity while maintaining fastening stability.
Solution Approach 2:
The clasp member is designed with multi-functionality: the base portion provides structural support and fastening, the clasp portions with slanting surfaces provide engagement and retention, and the air foils provide heat dissipation. This multi-functional design replaces the specialized functions of multiple separate components in the prior art with a single versatile component.
3Reliability
If a complex clasp member with eccentric wheel and spring arm is used to fix the heat sink, then the fastening stability is improved, but the manufacturing cost increases
Solution Approach 1:
The heat dissipating device is segmented into distinct functional modules: the heat sink with bottom portion and fins, the circuit board, and the clasp member with base portion and clasp portions. This segmentation allows each component to be manufactured independently using optimized processes and then assembled, reducing overall manufacturing complexity and cost compared to the integrated complex mechanism in the prior art.
Solution Approach 2:
The invention changes the geometric parameters of the clasp member to achieve fastening without complex mechanisms. The slanting portions are designed with specific angles and the expanded portions have optimized dimensions to provide adequate retention force. These parameter optimizations allow for simpler manufacturing processes while maintaining the required fastening stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables convenient disassembly and assembly, stable fastening of electronic components, and reduces manufacturing costs by simplifying the clasp mechanism, while enhancing heat dissipation efficiency through convection of heat energy from electronic components.
Implementation Method 1
heat conduction components used to effect heat absorption and heat dissipation
Implementation Method 2
enhancing heat dissipation efficiency through convection of heat energy from electronic components
Implementation Method 3
The first fastening member is provided with a press down spring arm
Implementation Method 4
one end of the handle is provided with an eccentric wheel that presses against the joining surface
Data Source
AI summary
The present invention provides a heat dissipating device combined structure, which consists of a heat sink and a clasp member. At least one expanded portion extends from the heat sink, and a side extends from each of the two sides of a base of the clasp member to form a conduit. The heat sink and a circuit board are disposed inside the conduit, and at least one ledge portion is formed on the sides. Moreover, a slanting portion extends from and is provided on air foils configured on the sides, and the ends of the slanting portions respectively clasp the expanded portions. Accordingly, the circuit board is mounted on the ledge portions, and electronic components on the circuit board are attached to the bottom portion of the aforementioned heat sink.