Heat Sink and Conductive Pipe Arrangement for Data Storage Cooling

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Solution Overview

Problem

Data storage systems face challenges in managing heat generated by electronic components within enclosures, particularly due to the obstruction of airflow by mid-plane circuit boards which hinder effective cooling of components positioned near the air outlet end.

Innovation Solution

The system employs air movers near the air outlet end, heat sinks thermally coupled to heat-generating components, and conductive pipes to transfer heat from these components to air movers, ensuring effective cooling without the need for components to be positioned directly in front of the air movers, and a 'floating' motherboard arrangement that enhances airflow.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If components are positioned directly in front of air movers for effective cooling, then cooling efficiency is improved, but device complexity and installation flexibility deteriorate

Engineering Contradiction:

Improvecooling efficiencyVSAvoidcomponent positioning flexibility

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent introduces heat sinks as intermediary components that thermally couple to heat-generating components and transfer heat to the airflow path. This mediator allows components to be positioned away from direct airflow while still achieving effective cooling through thermal conduction to the heat sink, which then dissipates heat to the moving air.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces direct mechanical positioning (components must be physically placed in front of air movers) with a thermal field-based solution using heat sinks and conductive pipes. This substitution allows cooling to be achieved through thermal conduction and convection mechanisms rather than requiring specific mechanical positioning, thereby increasing installation flexibility.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Strength

If mid-plane circuit boards are used to support components, then structural support is improved, but airflow obstruction increases

Engineering Contradiction:

Improvestructural supportVSAvoidairflow obstruction

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent extracts the cooling function from the mid-plane circuit board structure and implements it through separate heat sink components positioned at the rear end. This separation removes the cooling components that would otherwise obstruct airflow in the mid-plane region, allowing the circuit board to provide structural support without blocking the airflow path.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent relocates the heat sink components from the mid-plane (horizontal) dimension to the rear end (vertical/different spatial dimension). This dimensional relocation allows the circuit board to maintain its structural support function in the mid-plane while the cooling function is performed in a different spatial region that does not obstruct airflow.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Temperature

If components are positioned near the air outlet end for cooling, then cooling effectiveness is improved, but installation flexibility deteriorates

Engineering Contradiction:

Improvecooling effectivenessVSAvoidinstallation flexibility

Core Design Contradiction:

TemperatureVSEase of operation

Solution Approach 1:

The patent uses heat sinks and conductive pipes as intermediary thermal transfer mechanisms that allow components to be positioned at various locations within the enclosure. The heat sink acts as a mobile thermal conduit that can be attached to components regardless of their position, and the conductive pipes provide flexible thermal pathways to the air movers, thereby maintaining installation flexibility while ensuring cooling effectiveness.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves airflow and cooling efficiency within the enclosure, effectively managing heat from components like integrated circuits and data connectors, even when they are not directly in front of the air movers, thereby maintaining optimal temperature ranges.

Implementation Method 1

a first conductive pipe thermally coupled between the heat-generating electrical component and the first heat sink

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

air movers positioned near the air outlet end... to draw air from the front air inlet end

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS11516941B2Heat sink and printed circuit board arrangements for data storage systems

Publication Date: 2022.11.29 SEAGATE TECH LLC

AI summary

A system includes an enclosure having an air inlet end and an air outlet end, air movers positioned near the air outlet end, a first data connector positioned near the air outlet end between the air movers, a heat-generating electrical component positioned immediately between the data connector and the air inlet end, a first heat sink positioned immediately between at least one of the air movers and the air inlet end, and a first conductive pipe thermally coupled between the heat-generating electrical component and the first heat sink.