Heat Sink Base Plate With Cooling Inserts for Better Heat Conduction
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Solution Overview
Problem
Existing heat sinks made of aluminum have insufficient thermal conductivity, while those made of copper, although more conductive, are heavy and expensive, and junctions between copper and aluminum degrade heat transfer performance.
Innovation Solution
A heat sink design featuring a base plate of a first material with integrated cooling inserts made of a second, more thermally conductive material, eliminating material junctions in the main heat transfer direction and optimizing cooling insert placement near electrical components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is made of copper to improve thermal conductivity, then heat transfer capability is improved, but weight increases and cost increases
Solution Approach 1:
The patent applies local quality by using copper inserts only in specific locations where heat generation occurs (at the base plate level near heat-generating components) rather than making the entire heat sink from copper. This localized application of high thermal conductivity material optimizes heat transfer at critical points while minimizing overall weight and cost.
Solution Approach 2:
The heat sink is segmented into different material zones: a base plate (aluminum or other material), copper inserts positioned at specific locations for enhanced heat conduction, and aluminum cooling fins. This segmentation allows each component to be optimized for its specific function while balancing overall performance with weight and cost considerations.
2Temperature
If a heat sink is made of copper to improve thermal conductivity, then heat transfer capability is improved, but cost increases
Solution Approach 1:
The patent applies local quality by using copper inserts only in specific locations where heat generation occurs (at the base plate level near heat-generating components) rather than making the entire heat sink from copper. This localized application of high thermal conductivity material optimizes heat transfer at critical points while minimizing overall weight and cost.
Solution Approach 2:
The heat sink is segmented into different material zones: a base plate (aluminum or other material), copper inserts positioned at specific locations for enhanced heat conduction, and aluminum cooling fins. This segmentation allows each component to be optimized for its specific function while balancing overall performance with weight and cost considerations.
3Adaptability or versatility
If a heat sink uses junctions between copper and aluminum to combine material benefits, then material efficiency is improved, but heat transfer capability deteriorates due to detrimental junctions
Solution Approach 1:
The patent extracts the problematic junction interface by placing copper inserts directly into through-holes of the base plate, creating a push-fit or interference fit connection that eliminates the need for traditional copper-aluminum junctions. This extraction of the junction interface removes the thermal resistance problem while maintaining the benefits of combining different materials.
Solution Approach 2:
The base plate through-holes act as an intermediary structure that connects the copper inserts to the base plate without creating a traditional material junction. The through-hole configuration provides a thermal pathway that avoids the detrimental copper-aluminum interface while still allowing heat transfer from the base plate through the copper inserts to the cooling fins.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat transfer capability while minimizing the use of the more conductive material, reducing weight and cost, and allowing versatile positioning without compromising cooling efficiency.
Implementation Method 1
a base plate made of a first material and at least one cooling insert made of second material whose thermal conductivity is better than thermal conductivity of the first material
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
A heat sink comprising a base plate (2) made of a first material and having a first surface (21) adapted to be in a heat conducting connection with at least one electrical component (100'), and a second surface (22) adapted to transfer heat away from the base plate (2), the second surface (22) facing an opposite direction than the first surface (21). The heat sink comprises at least one cooling insert (4) made of a second material whose thermal conductivity is better than thermal conductivity of the first material. The base plate (2) comprises at least one through hole extending from the first surface (21) to the second surface (22) thereof, and the at least one cooling insert (4) is located in the at least one through hole.