Heat Sink Assembly With Copper Interlayer for Al-Cu Welding
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Solution Overview
Problem
The challenge in manufacturing heat dissipation devices is the difficulty in directly welding aluminum and copper materials due to oxidation and eutectic formation, leading to fragile joints and environmental concerns associated with chemical nickel plating used for surface modification.
Innovation Solution
A copper embedding layer is applied to the aluminum base seat and radiating fin assembly, allowing direct welding of heterogeneous metal materials without surface modification, reducing costs and environmental impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If aluminum and copper materials are directly welded without surface modification, then manufacturing cost is reduced and environmental impact is minimized, but the welding quality deteriorates due to oxidation and eutectic structure formation
Solution Approach 1:
A copper embedding layer is introduced as an intermediary between the aluminum base seat and the copper heat pipe. This copper layer serves as a mediator that facilitates welding between the aluminum and copper materials, eliminating the need for chemical nickel treatment while ensuring reliable welding quality by preventing direct contact between aluminum and copper surfaces that would otherwise form eutectic structures.
2Reliability
If chemical nickel treatment is applied to the aluminum surface, then welding capability with copper is improved, but environmental harm increases and cost becomes unstable
Solution Approach 1:
The harmful chemical nickel treatment process is completely removed from the manufacturing workflow. Instead of applying electroless nickel plating to the aluminum surface, the invention extracts the nickel plating step entirely and replaces it with a copper embedding layer approach that achieves the same welding facilitation without environmental harm and cost instability.
Solution Approach 2:
The invention replaces the complex, expensive, and environmentally harmful nickel plating process with a simpler copper embedding layer that can be applied through less costly methods. The copper embedding layer serves its purpose during welding and can be removed or integrated without requiring expensive chemical processing equipment or specialized facilities.
3Reliability
If electroless nickel plating is used to modify the aluminum surface, then welding with copper becomes feasible, but manufacturing complexity and cost increase
Solution Approach 1:
The complex electroless nickel plating process is extracted and removed from the manufacturing sequence. The invention simplifies the process by eliminating the need for chemical nickel treatment, surface preparation, and post-plating processing, replacing it with a simpler copper embedding layer application that reduces both process complexity and manufacturing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables effective heat dissipation by allowing direct welding of aluminum and copper components, lowering costs and addressing environmental concerns while maintaining efficient heat transfer.
Implementation Method 1
The aluminum surface of the aluminum base seat is easy to oxidize to produce an oxide (AlO3) of high melting point in the welding process. The oxide (AlO3) will directly hinder the aluminum material from being fused with copper metal.
Implementation Method 2
By means of the copper embedding layer, the aluminum base seat can be respectively directly welded and connected with a copper heat pipe made of heterogeneous metal material or the aluminum radiating fin assembly made of the same material without chemical nickel treatment procedure.
Implementation Method 3
a U-shaped copper heat pipe (14). The U-shaped copper heat pipe has a heat dissipation section passing through the perforations of the aluminum radiating fin assembly and a heat absorption section connected with the connection section of the aluminum base seat
Data Source
AI summary
A heat dissipation device assembly includes an aluminum base seat, an aluminum radiating fin assembly and at least one U-shaped copper heat pipe, which is upright arranged or horizontally arranged. The aluminum base seat has at least one connection section. A copper embedding layer is disposed on the connection section. The aluminum radiating fin assembly is assembled and disposed on the aluminum base seat. The copper heat pipe has a heat dissipation section and a heat absorption section respectively connected on the aluminum radiating fin assembly and the connection section of the aluminum base seat. By means of the copper embedding layer, the aluminum base seat and the copper heat pipe can be directly welded and connected with each other without chemical nickel treatment.