Heat Sink Shielding Structure for EMC and Thermal Dissipation
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Solution Overview
Problem
Existing electronic devices face challenges in simultaneously achieving effective thermal management and electromagnetic interference shielding for heat-generating components, often requiring compromises between thermal dissipation and EMC shielding.
Innovation Solution
An electronic device design incorporating a heat sink connected to electronic components via a conductive pedestal, with an electroconductive elastic element attached to both the pedestal and circuit board, providing both thermal transfer and local EMC shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If local EMC shielding means are added around electronic components, then electromagnetic interference protection is improved, but thermal dissipation capability deteriorates
Solution Approach 1:
The patent combines EMC shielding function and thermal management function into a single integrated structure. The electroconductive elastic element serves dual purposes: providing electromagnetic shielding around the electronic component while simultaneously acting as a thermal conduction path to transfer heat away from the component, thus resolving the contradiction between shielding and heat dissipation.
Solution Approach 2:
The electroconductive elastic element is designed to perform multiple functions simultaneously: it provides electromagnetic shielding, conducts heat away from the component, and offers mechanical compliance through its elastic properties. This multi-functionality allows the same structure to address both EMC requirements and thermal management needs without compromising either.
2Temperature
If heat transfer means are added to electronic components, then thermal dissipation is improved, but electromagnetic shielding capability deteriorates
Solution Approach 1:
The patent merges the heat transfer function and electromagnetic shielding function into a single integrated element. The electroconductive elastic element simultaneously serves as both a thermal conduction path and an electromagnetic shield, eliminating the need to choose between thermal management and EMC protection.
Solution Approach 2:
The electroconductive elastic element can be constructed from composite materials or structured designs that provide both high thermal conductivity for heat transfer and high electrical conductivity for electromagnetic shielding, thus achieving both thermal dissipation and EMC protection simultaneously.
3Object-affected harmful factors
If additional multi point grounding pedestals are attached around the IC, then electromagnetic shielding is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into a single element: the electroconductive elastic element provides both electromagnetic shielding and thermal conduction, eliminating the need for separate grounding pedestals and heat sinks, thus reducing device complexity while maintaining or improving performance.
Solution Approach 2:
The electroconductive elastic element is designed as a multi-functional component that simultaneously provides electromagnetic shielding, thermal management, and mechanical compliance, replacing what would traditionally require multiple separate components and simplifying the overall device structure.
4Device complexity
If software degradation is accepted to manage heat, then thermal management is simplified, but functionality and performance deteriorate
Solution Approach 1:
The patent replaces software-based thermal management (which degrades functionality) with a physical/thermal solution: the electroconductive elastic element provides passive thermal conduction through its material properties, managing heat without requiring software intervention that would compromise performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat while shielding electronic components from electromagnetic emissions, preventing overheating and interference, simplifying design and reducing the need for additional grounding or software adjustments.
Implementation Method 1
The heat sink is conductively connected to the at least one electronic component... configured to transport heat from the at least one electronic component
Implementation Method 2
the at least one electroconductive elastic element is configured to shield the at least one electronic component against electromagnetic emission
Implementation Method 3
The at least one electroconductive elastic element may electrically connect the heat sink to the circuit board
Data Source
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AI summary
An electronic device comprises at least one electronic component arranged on a circuit board and a heat sink conductively connected to the at least one electronic component. The electronic device further comprises at least one electroconductive elastic element attached to the heat sink and the circuit board, wherein the at least one electroconductive elastic element is configured to shield the at least one electronic component against electromagnetic emission.