Heat Sink Fin Angular Dimples Micro Air Channels
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Solution Overview
Problem
In densely packed electronic systems, such as avionics with printed board assemblies, conventional heat dissipation methods using solid metal plates are inadequate due to space constraints and limited performance, as they are heavy and bulky, making it difficult to implement convective thermal solutions like fans or blowers.
Innovation Solution
The development of an entrainment heat sink with fabricated fins that incorporate micro air flow channels and nozzles, allowing for low-profile convective cooling by directing compressed air jets parallel to the fin surface, fabricated using methods like chemical etching or EDM on copper foil, which can be laminated onto metal plates or other foils, enabling efficient thermal management in space-constrained environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional solid metal plates are used for heat dissipation, then heat dissipation capability is provided, but weight and volume increase
Solution Approach 1:
The solid metal plate is segmented into a array of fin structures with multiple discrete heat dissipation elements. Each fin is a separate component that can be individually optimized, and the distributed arrangement provides equivalent or superior heat dissipation with reduced material usage and weight compared to a solid plate of the same footprint.
Solution Approach 2:
The patent employs thin fin structures with thicknesses on the order of micrometers to millimeters, representing a transition from bulk solid metal to thin-film-like heat dissipation elements. These thin fins dramatically reduce weight while maintaining effective heat dissipation surface area, directly addressing the weight penalty of conventional solid metal plates.
2Temperature
If conventional solid metal plates are used for heat dissipation, then heat dissipation capability is provided, but space constraints are violated due to bulky structure
Solution Approach 1:
By dividing the heat dissipation function into multiple thin fin segments arranged in an array, the overall volume is dramatically reduced compared to a solid metal plate. The fins are spaced apart and connected to a common base, creating a low-profile structure that fits within tight space constraints while providing extensive heat dissipation surface area.
Solution Approach 2:
The thin-film-like fin structures with micrometer to millimeter thicknesses enable the heat sink to achieve high surface area-to-volume ratio, allowing effective heat dissipation in a compact footprint. This thin-film approach reduces the z-direction height significantly compared to solid metal plates.
3Temperature
If fans or blowers are used for convective cooling, then heat dissipation performance is improved, but device complexity and space requirements increase
Solution Approach 1:
The fin structures are designed to be self-sufficient heat dissipation elements that passively conduct heat from the base to their surfaces. The array configuration and thermal conduction pathways are engineered to enable effective heat dissipation without requiring external active cooling components like fans or blowers, thereby reducing device complexity.
Solution Approach 2:
The patent employs micro-channel fluidic pathways integrated into the fin structures that enable convective heat transfer through controlled fluid flow. This pneumatic approach allows for efficient heat dissipation using minimal fluid flow rates, eliminating the need for bulky fan assemblies while maintaining high heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides effective heat dissipation in tight spaces by utilizing micro air channels and nozzles to direct compressed air, overcoming the limitations of conventional solid metal plates, enabling high-performance thermal management suitable for densely packed electronic systems.
Implementation Method 1
micro air flow channels and nozzles, allowing for low-profile convective cooling by directing compressed air jets parallel to the fin surface
Implementation Method 2
enabling efficient thermal management in space-constrained environments
Data Source
AI summary
A heat sink fin that has a first substrate. The first substrate includes a first angular dimple and a first micro air channel in fluid communication with the first angular dimple. The first angular dimple includes a first surface that forms an angle relative to a first plane of the first substrate. The first angular dimple includes a first micro diameter hole in fluid communication with the first angular dimple. The heat sink fin also has a second substrate folded against the first substrate. The second substrate includes a second angular dimple and a second micro air channel in fluid communication with the second angular dimple. The second angular dimple includes a second surface that forms an angle relative to a second plane of the second substrate. The second angular dimple includes a second micro diameter hole in fluid communication with the second angular dimple.