Heat Sink Fin Interconnection for Solar Receiver Thermal Management
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Solution Overview
Problem
Existing photovoltaic systems face thermal management issues and partial discharge failures due to the use of 'zippered' heat sink designs, which require additional metal layers for assembly, increasing costs and complexity.
Innovation Solution
A heat sink design with reduced or eliminated mechanical engagement features at the fin bases, utilizing a configuration of J-shaped fin members with thermally conductive connections that avoid surface irregularities, allowing for effective heat dissipation without additional metal layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If mechanical engagement features (projections and apertures) are used in the zippered fin design, then the fins can be interconnected, but partial discharge failures occur at the fin bases
Solution Approach 1:
The patent removes mechanical engagement features (projections and apertures) from the fin bases entirely. Instead of using interlocking mechanical features, the fins are connected through thermal interface material applied to the outer base surfaces, eliminating the source of partial discharge failures while maintaining structural integrity through alternative means.
Solution Approach 2:
The patent introduces thermal interface material as an intermediary substance between the fin bases and the heat source. This mediator provides both thermal conduction and mechanical bonding functions, replacing the need for direct mechanical engagement features and eliminating the partial discharge problem associated with protrusions and apertures at the fin bases.
2Reliability
If an additional layer of metal is bonded to the fin bases, then thermal connection to the solar cell is achieved, but material cost and assembly labor increase
Solution Approach 1:
The patent combines the thermal interface material layer with the fin base structure itself, eliminating the need for a separate additional metal layer. The thermal interface material is applied directly to the outer base surfaces of the fins, which are already in place, thereby achieving thermal connection without adding extra material layers or assembly steps.
Solution Approach 2:
The fin bases are designed with outer base surfaces that directly receive and conduct thermal interface material to establish thermal connection with the heat source. The structure serves its own thermal conduction function without requiring an additional metal layer, reducing both material costs and assembly complexity.
3Strength
If projections and apertures are used for fin interconnection, then mechanical engagement is achieved, but surface irregularities cause partial discharge failures
Solution Approach 1:
The patent completely removes projections and apertures from the fin bases, eliminating the mechanical engagement features that create surface irregularities. Instead, smooth outer base surfaces are used in combination with thermal interface material to achieve both mechanical stability and electrical insulation, preventing partial discharge failures.
Solution Approach 2:
Thermal interface material serves as an intermediary that provides mechanical bonding between fins and the heat source without creating surface irregularities. This mediator layer fills gaps and conforms to surfaces, providing strong adhesion while maintaining a smooth interface that prevents partial discharge, replacing the need for protrusions and apertures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces partial discharge failures and manufacturing costs by eliminating the need for additional metal layers, while maintaining effective thermal management and heat dissipation in photovoltaic systems.
Implementation Method 1
a first heat discharge portion configured to discharge heat energy through convective loss
Implementation Method 2
The fin array can be connected to a solar cell using a thermally conductive material
Data Source
AI summary
A solar energy receiver can include a heat sink configured to cool or otherwise dissipate heat. The heat sink can include a plurality of fin members, each having bases that are generally aligned with each other. The bases of the fin members can be connected to one another with connection devices that are spaced away from the bases, so as to improve thermal conductivity performance characteristics.