Integrated Heat Sink Flow Channels for Reliable Device Cooling
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Solution Overview
Problem
Conventional heat sinks have low heat conduction capability and reliability, which poses a challenge in effectively dissipating the increasing heat generated by communication devices.
Innovation Solution
A heat sink design featuring a substrate with an integrated heat dissipation structure, comprising a connection part and a fin part connected at an included angle, with a cooling flow channel located within the fin part to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional heat sink design is used, then manufacturing is simple, but heat conduction capability is low
Solution Approach 1:
The patent merges the connection part and fin part into an integrated heat dissipation structure, eliminating the need for separate components and assembly processes. This integration maintains manufacturing simplicity while improving heat conduction capability by ensuring better thermal contact and structural coherence between previously separate elements.
2Reliability
If conventional heat sink design is used, then structure is simple, but heat conduction capability is low
Solution Approach 1:
The patent introduces a cooling flow channel that extends from the connection part into the fin part, adding a three-dimensional thermal management dimension to the traditional two-dimensional fin structure. This dimensional enhancement improves heat conduction capability by providing an internal heat transfer pathway while maintaining overall structural simplicity.
3Ease of manufacture
If conventional heat sink design is used, then manufacturing is simple, but heat dissipation reliability is low
Solution Approach 1:
The integrated heat dissipation structure combines the connection part and fin part into a single manufacturable component, maintaining ease of manufacture through unified production processes while significantly improving heat dissipation reliability by eliminating assembly interfaces and ensuring consistent thermal performance.
4Reliability
If conventional heat sink design is used, then space occupation is large, but heat dissipation performance is insufficient
Solution Approach 1:
The patent utilizes the internal volume of the fin part by extending the cooling flow channel into it, transforming the traditionally solid fin structure into a hollow thermal conduit. This dimensional reconfiguration improves heat dissipation performance by maximizing the use of internal space for active cooling while reducing the overall heat sink volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved heat sink design achieves enhanced heat conduction and dissipation reliability, reducing the volume, weight, and thermal resistance of the heat sink while maintaining effective heat dissipation performance.
Implementation Method 1
a cooling flow channel, and at least a part of the cooling flow channel is located in the fin part; and a refrigerating medium, where the refrigerating medium flows in the cooling flow channel to dissipate heat from the substrate
Implementation Method 2
a heat dissipation structure, where the heat dissipation structure includes a connection part and a fin part that are of an integrated structure, the connection part is connected to the substrate
Data Source
AI summary
A heat sink includes a substrate, a heat dissipation structure, and a refrigerating medium. The heat dissipation structure includes a connection part and a fin part that are of an integrated structure, the connection part is connected to the substrate, the fin part and the connection part are disposed at an included angle, a fin root of the fin part is connected to the connection part, and a fin top of the fin part is far away from the connection part, a cooling flow channel is disposed in the heat dissipation structure, and at least a part of the cooling flow channel is located in the fin part. The refrigerating medium flows in the cooling flow channel to dissipate heat from the substrate. A heat conduction capability of the heat sink can therefore be improved, and heat dissipation reliability is ensured.