Heat Sink Fluid Path Parallel Orientation for Thermal Gradient
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Solution Overview
Problem
Existing cooling devices for information processing apparatuses face inefficiencies in heat exchange due to varying air flow speeds and temperature distributions, which affect the cooling performance of heat sinks and refrigeration systems.
Innovation Solution
A cooling device comprising a heat sink thermally coupled with a fluid path that allows a predetermined fluid to pass through, featuring a heat exchange portion with branched paths that absorb and discharge heat efficiently by reversing air flow direction, enhancing heat transfer between the heat sink and the fluid path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional heat sink with fixed fins is used, then the structure is simple, but the cooling efficiency varies with air flow speed and temperature distribution
Solution Approach 1:
The heat sink is divided into multiple independent heat exchange portions, each with its own fluid path. This segmentation allows each portion to independently optimize heat exchange based on local temperature distribution and air flow conditions, improving overall cooling efficiency without requiring a completely complex redesign of the entire heat sink structure.
Solution Approach 2:
The patent introduces a fluid path that allows fluid to flow through the heat sink in a direction opposite to the conventional air flow direction. This inversion enables the fluid to absorb heat from the heat sink from the back side, creating a more effective thermal gradient and improving heat exchange efficiency while maintaining a relatively simple overall structure.
2Temperature
If air cooling is used for the cooling target object, then the device structure is simple, but heat is discharged to the inside of the apparatus causing temperature rise
Solution Approach 1:
The patent introduces a fluid (such as liquid coolant) as an intermediary medium between the heat sink and the cooling target object. This fluid absorbs heat from the heat sink and transports it away from the apparatus, preventing heat from being discharged into the internal environment and causing temperature rise, while maintaining a simple device structure.
3Reliability
If the fluid path is arranged perpendicular to the heat receiving face, then the path length is short, but the heat exchange efficiency is reduced
Solution Approach 1:
The patent arranges the fluid path to extend in a direction approximately parallel to the heat receiving face, utilizing the lateral dimension of the heat sink rather than just the depth dimension. This dimensional change allows the fluid to traverse a longer path through the heat exchange portions, improving heat exchange efficiency without requiring an excessively long path that would increase device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat reception from the cooling target object, achieving efficient cooling by maintaining a thermal gradient that increases the cooling effect and reduces the risk of overheating in electronic components.
Implementation Method 1
a heat sink (11) and a fluid path (12)... thermally coupled with a fluid path that allows a predetermined fluid to pass through
Implementation Method 2
the fluid path (12)... allows a predetermined fluid to pass through... heat exchange portion with branched paths that absorb and discharge heat
Data Source
AI summary
In order to enhance heat reception from a cooling target object by a heat sink to efficiently cool a device, the cooling target object, a cooling device including a heat sink and a fluid path is provided. Further, the heat sink includes a heat receiving face. The fluid path is formed so as to allow a predetermined fluid to pass therethrough. The heat exchange portion includes a first path arranged approximately in parallel to the heat receiving face of the heat sink.