Heat Sink Foot Section Direct Circuit Board Contact
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Solution Overview
Problem
The challenge is to effectively dissipate heat from electronic components on a circuit board without using intermediate heat conducting pieces, which can disrupt thermal flow and lead to excessive operating temperatures, potentially causing component failure.
Innovation Solution
A heat sink with a foot section that directly bears on a heat conducting section of the circuit board, featuring a recess to house the electronic component, allowing for direct heat transfer without intermediate pieces, and optionally using centering elements for precise alignment to avoid electrical shorts and ensure efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If intermediate heat conducting pieces are used to connect the heat sink to the circuit board, then the heat sink can be connected to the heat conducting path, but the intermediate pieces disturb the thermal flow and reduce heat dissipation efficiency
Solution Approach 1:
The invention extracts and eliminates the intermediate heat conducting pieces from the thermal path. The heat sink is designed with a foot section that directly contacts the heat conducting section of the circuit board, removing the intermediate components that were disturbing the thermal flow and reducing heat dissipation efficiency.
Solution Approach 2:
The invention merges the heat sink with the circuit board by establishing direct thermal contact between the foot section of the heat sink and the heat conducting section of the circuit board. This integration eliminates the need for separate intermediate heat conducting pieces and creates a unified thermal management system.
2Area of stationary object
If multiple electronic components are disposed close next to one another on the circuit board, then space utilization is improved, but the exhaust heat leads to impermissible operating temperatures
Solution Approach 1:
The invention utilizes the vertical dimension by extending the heat sink below the circuit board plane with foot sections that contact heat conducting sections on the opposite side of the circuit board. This three-dimensional heat dissipation approach allows components to be closely packed on the surface while heat is efficiently removed through the vertical thermal path, preventing temperature buildup.
3Reliability
If a heat sink spans the electronic component in the manner of a bridge, then direct heat transfer to both heat conducting sections is achieved, but the heat sink structure becomes more complex
Solution Approach 1:
The heat sink is segmented into distinct functional regions: a main body that contacts the top of the electronic component and foot sections that extend to contact the heat conducting sections of the circuit board. This segmentation allows the heat sink to efficiently transfer heat from multiple points while maintaining a relatively simple overall structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables swift and effective dissipation of bottom heat, preventing operating temperature increases beyond permissible limits and ensuring reliable heat transfer, even when multiple components are closely packed, by eliminating intermediate pieces and ensuring direct contact with heat conducting sections.
Implementation Method 1
the heat sink by way of a foot section bears directly on a heat conducting section of the circuit board that dissipates the bottom heat such that the bottom heat is swiftly dissipated by way of the heat conducting section of the circuit board and the heat sink
Data Source
AI summary
The invention is directed to an arrangement for dissipating heat of an electronic component mounted on a circuit board. The arrangement includes a heat sink for dissipating heat of an electronic component. In order for bottom heat of the electronic component to be dissipated, at least one heat-dissipating heat conducting section is configured on the circuit board, wherein the heat sink is connected in a heat transmitting manner to the heat conducting section of the circuit board. The heat sink by way of a foot section bears directly on the heat conducting section of the circuit board. A recess is configured in the base body of the heat sink, wherein the electronic component lies at least partially in the recess.