Semiconductor Module Heat Sink Structure for Insulation Sheet Cooling
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Solution Overview
Problem
Conventional semiconductor modules require high thermal resistance insulation sheets, which increase manufacturing costs due to the need for specific filler content and resin materials, and the insulation sheets are not effectively cooled when positioned between the frame and heat sink or under the semiconductor devices.
Innovation Solution
A semiconductor module design where the insulation sheet is placed on the lower surface of the heat sink, with the heat sink's thickness being at least 50% of the module body's thickness, allowing for effective separation from the semiconductor devices and reducing the need for high thermal resistance insulation, along with a manufacturing method that separates mold shaping into two parts to optimize resin material and conditions for each sealing member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the insulation sheet is positioned between the frame part and the heat sink, then the insulation sheet can insulate electric power circuits, but the insulation sheet is exposed to high temperature from the semiconductor device and requires high thermal resistance materials
Solution Approach 1:
The insulation sheet is relocated from a horizontal position between the frame and heat sink to a vertical position on the lower surface of the heat sink. This spatial repositioning changes the thermal exposure environment, allowing the use of lower thermal resistance materials while maintaining insulation effectiveness.
2Temperature
If the insulation sheet is provided at the lower surface of the heat sink, then the insulation sheet is separated from the heat generating source, but additional mold shaping steps are required
Solution Approach 1:
The mold shaping process is divided into two separate operations: first shaping the heat sink with the insulation sheet attached to its lower surface, then shaping the frame part separately. This segmentation allows each component to be optimized independently while maintaining the thermal separation benefit.
3Temperature
If the heat sink thickness is increased to at least 50% of the module body thickness, then the insulation sheet is sufficiently cooled and separated from the semiconductor device, but the overall module size increases
Solution Approach 1:
The heat sink thickness is optimized to a specific parameter range (at least 50% of the module body thickness) to achieve sufficient thermal separation and cooling of the insulation sheet. This parameter optimization balances heat dissipation performance with compact module dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the ambient temperature of the insulation sheet, prevents heat breakdown, and lowers manufacturing costs by eliminating the need for high thermal resistance insulation, while improving heat-releasing performance and allowing for the use of higher operation temperature semiconductor devices.
Implementation Method 1
a heat sink joined to a lower surface of the frame part... the heat sink is sufficiently cooled
Data Source
AI summary
A semiconductor module includes: a frame part; a semiconductor device mounted on an upper surface of the frame part; a heat sink joined to a lower surface of the frame part; an insulation sheet provided on a lower surface of the heat sink; and a sealing member sealing the frame part, the semiconductor device, and the heat sink to form a module body, wherein a thickness of the heat sink is equal to or larger than 50% of a thickness of the module body.