Heat Sink Interconnect Assembly for PCB-Free Antenna Arrays
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Solution Overview
Problem
The integration of high-bandwidth radios with antenna arrays on PCBs faces challenges due to difficult routing and interconnect issues, high manufacturing costs, and heat dissipation problems, particularly in radio network equipment like base stations and remote-radio heads.
Innovation Solution
An electrical component assembly that integrates a heat sink with an electrical interconnect, where the interconnect is partly arranged in and extends along cavities between components, using additive manufacturing to deposit dielectric and conductive materials, allowing direct soldering of components to the heat sink without a PCB.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If cables and connectors are used for interconnecting components, then electrical connections can be established, but the assembly becomes complex and difficult to cool effectively
Solution Approach 1:
The patent merges the electrical interconnect and thermal management functions into a single integrated structure. The heat sink serves dual purposes: it provides thermal dissipation pathways while simultaneously housing embedded conductive traces that establish electrical connections between components, eliminating the need for separate cables and connectors
Solution Approach 2:
The heat sink is designed as a multi-functional component that performs both thermal management and electrical interconnection. By embedding conductive material within the heat sink structure, the same component that cools the RFIC also provides the electrical pathway to other components, reducing overall system complexity
2Speed
If the area under the antenna array is scaled down for higher frequencies, then frequency performance improves, but the area available for component packages and routing becomes smaller
Solution Approach 1:
The patent utilizes the vertical dimension by embedding conductive traces within the heat sink structure rather than routing them on the surface. This three-dimensional approach to interconnection allows for efficient signal routing without consuming additional planar area, enabling the design to accommodate higher frequency requirements
3Temperature
If direct contact with heat sink is used for thermal management, then heat removal is effective, but electrical interconnection becomes more difficult
Solution Approach 1:
The patent combines thermal management and electrical interconnection into a single integrated system. The heat sink serves as both the thermal pathway for heat removal and the substrate for embedded conductive traces that provide electrical connections, eliminating the need for separate interconnection mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces manufacturing costs, provides a small footprint, and enables effective heat removal while eliminating the need for cables or PCBs, offering a good thermal and electrical connection with low resistance.
Implementation Method 1
the power generated in a typical radio product may be in the range of 100 W-1000 W and the heat dissipation in the radio is thus considerable
Implementation Method 2
The electrical interconnect comprises at least one layer of deposited material comprising electrically conductive material forming one or more interconnecting conductors
Data Source
AI summary
An electrical component assembly (301) comprising a heat sink (310), electrical components (321-1, 321-2, 322, 323) arranged on the heat sink (310) and an interconnect (330a) electrically connecting the electrical components (321-1, 321-2, 322, 323). The heat sink (310) is integrated with the electrical interconnect (330a) such that the electrical interconnect (330a) is at least partly arranged in and extends along a cavity (311a, 311b) of the heat sink (310). The electrical interconnect (330a) comprises at least one layer (332, 334) of deposited material comprising electrically conductive material forming one or more interconnecting conductors (338, 339). The interconnect further comprises one or more dielectric layers (331, 333, 335) of deposited material which isolate the one or more interconnecting conductors (338, 339). The one or more interconnecting conductors (338, 339) electrically contacts the respective electrical component in a respective contact area (311-c) of the cavity (311a, 311b). The electrical components (321-1, 321-2, 322, 323) are arranged on the heat sink (310) such that a respective one of one or more electrical contacts (321-c1) of the electrical components align with a respective interconnecting conductor (351).