Refrigerant-Grooved Heat Sink for Compact MIMO Antenna Cooling
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Solution Overview
Problem
Existing heat sink structures for MIMO antennas face challenges in rapid heat dissipation due to mechanical air cooling designs, which result in increased size and reduced efficiency.
Innovation Solution
A heat sink structure that incorporates a cover plate with a refrigerant chamber and refrigerant condensing grooves, allowing for rapid condensation of gaseous refrigerant and efficient heat dissipation, while minimizing size and improving performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a mechanical air cooling structure is used for heat dissipation, then the structure is simple to manufacture, but the heat dissipation speed is slow and the size increases
Solution Approach 1:
The patent replaces the mechanical air cooling system with a refrigerant-based thermal conduction system. The heat dissipation element directly contacts the cover plate which contains refrigerant, eliminating the need for mechanical fans or forced air circulation while achieving faster heat dissipation through phase change and thermal conduction.
Solution Approach 2:
The patent introduces a refrigerant chamber filled with refrigerant that utilizes fluid-based heat transfer. The refrigerant absorbs heat from the heat dissipation element through the cover plate, leveraging hydraulic/ pneumatic principles for efficient thermal energy transfer and rapid heat dissipation.
2Device complexity
If a mechanical air cooling structure is used for heat dissipation, then the structure is simple, but the overall device size increases
Solution Approach 1:
The patent embeds the refrigerant chamber within the cover plate structure, and the heat dissipation element within the refrigerant chamber. This nested arrangement allows multiple functional components to occupy overlapping spatial volumes, significantly reducing the overall heat sink size while maintaining structural simplicity.
Solution Approach 2:
The patent combines the cover plate and refrigerant chamber into an integrated structure, eliminating separate components and reducing overall volume. The heat dissipation element is also merged with the cover plate through direct thermal contact, creating a compact unified system.
3Productivity
If refrigerant condensing grooves are added to the refrigerant chamber, then heat dissipation performance improves, but manufacturing complexity increases
Solution Approach 1:
The patent creates grooves in the refrigerant chamber that form a porous-like structure, increasing the surface area available for heat exchange between the refrigerant and heat dissipation element. This porous configuration enhances heat dissipation performance while the grooves can be formed through standard manufacturing processes.
Solution Approach 2:
The patent adds grooves to the refrigerant chamber that create three-dimensional heat exchange surfaces from a two-dimensional plane. This dimensional enhancement increases the effective heat transfer area without proportionally increasing the overall volume, improving heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed heat sink structure effectively rapid-discharges heat generated from MIMO antennas by condensing gaseous refrigerant, thereby enhancing heat dissipation performance while maintaining a compact size.
Implementation Method 1
A gaseous refrigerant subjected to a heat exchange with the cover plate is condensed in the plurality of refrigerant condensing grooves while flowing
Implementation Method 2
The cover plate receives the heat of the heat dissipation element. A gaseous refrigerant subjected to a heat exchange with the cover plate is condensed
Data Source
AI summary
A heat sink structure according to the present invention comprises: a cover plate having one surface on which a printed circuit board provided with a heat generating element is mounted to receive heat from the heat generating element; and a heat sink body part having an inner space divided, by the cover plate, into a receiving space, in which the printed circuit board is received, and a refrigerant chamber in which a refrigerant is filled, wherein a plurality of refrigerant condensation grooves, in which a gaseous refrigerant thermally exchanged with the cover plate is condensed while flowing, are formed on at least one surface of the refrigerant chamber so that a gaseous refrigerant thermally exchanged with heat generated by the heat generating element is rapidly condensed and thus the heat generated in the heat generating element can be rapidly dissipated.