Heat Sink Configuration for Compact Motor Control Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Motor devices require reduced size for installation in various applications while maintaining effective heat dissipation.
Innovation Solution
A control device configuration with a first substrate, a second substrate, and a heat sink where the second substrate's tall components are received in a component receiving portion of the heat sink, and heat dissipation occurs through a separate heat dissipation portion, allowing for reduced heat sink thickness and enhanced heat dissipation by positioning the heat sink between the substrates and using a partition and peripheral wall for efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the heat sink thickness is reduced to make the motor device more compact, then the device size is reduced, but the heat dissipation effectiveness deteriorates
Solution Approach 1:
The heat sink is divided into two distinct functional portions: a component receiving portion that houses tall electronic components and a heat dissipation portion that contacts substrates for heat transfer. This segmentation allows each portion to be optimized independently, enabling reduced overall thickness while maintaining effective heat dissipation through the dedicated heat dissipation portion.
Solution Approach 2:
Different regions of the heat sink are assigned different functions and properties: the component receiving portion is designed to accommodate tall components (such as capacitors) with sufficient clearance, while the heat dissipation portion is optimized for thermal contact with substrates. This local differentiation allows the heat sink to be thin overall while still providing adequate space for tall components and effective heat dissipation pathways.
2Adaptability or versatility
If tall electronic components are accommodated in the heat sink, then all required components can be mounted, but the heat sink thickness must be increased
Solution Approach 1:
The heat sink utilizes the vertical dimension efficiently by creating a component receiving portion that extends in the thickness direction to accommodate tall electronic components. Meanwhile, the heat dissipation portion is positioned to contact substrates on opposite faces, creating parallel heat dissipation pathways that do not require additional thickness. This dimensional arrangement allows tall components to be housed without proportionally increasing the heat sink thickness required for heat dissipation.
Solution Approach 2:
Tall electronic components are nested within the component receiving portion of the heat sink structure. The component receiving portion is integrated into the heat sink body, allowing tall components to be housed within the overall heat sink envelope rather than requiring separate mounting space that would increase total thickness.
3Temperature
If the heat sink is positioned between the first substrate and second substrate, then heat dissipation path is optimized, but tall components on the second substrate may interfere with the heat sink
Solution Approach 1:
The heat sink is segmented into a component receiving portion and a heat dissipation portion. The component receiving portion is positioned to accommodate tall electronic components on the second substrate, preventing interference between these components and the heat dissipation portion. This segmentation allows the heat dissipation portion to maintain optimal contact with substrates while the component receiving portion provides clearance for tall components.
Solution Approach 2:
The component receiving portion acts as an intermediary structure between the tall electronic components and the heat dissipation portion. It provides a dedicated space that receives and isolates tall components, preventing them from interfering with the heat dissipation function while still being part of the integrated heat sink assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the motor device's size while ensuring effective heat dissipation, protecting components from dust and shock, and facilitating quicker heat transfer to the air, making it suitable for applications requiring compact motor control systems.
Implementation Method 1
the heat generated by these electronic components is dissipated through the heat sink
Implementation Method 2
the heat dissipation portion being configured to perform heat exchange between the first substrate and the second substrate
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
A control device includes a first substrate (22) provided with a chip electronic component; a second substrate (23) having a surface provided with electronic components including a tall component taller than the chip electronic component, the surface of the second substrate (23) facing a surface of the first substrate (22) that is provided with the chip electronic component; and a heat sink (21) disposed between the first substrate (22) and the second substrate (23). The heat sink (21) includes a component receiving portion (71) and a heat dissipation portion (72), the component receiving portion (71) being configured to receive the tall component, the heat dissipation portion (72) being configured to perform heat exchange between the first substrate (22) and the second substrate (23), and the component receiving portion (71) and the heat dissipation portion (72) being provided so as not to overlap with each other as viewed in a facing direction in which the first substrate (22) and the second substrate (23) face each other.