Heat Sink Recess Structure for Resin-Free IC Heat Dissipation
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Solution Overview
Problem
Existing electronic units with heat-generating components and heat sinks mounted on substrates face inefficiencies in heat radiation due to the heat sink being filled with hot-melt sealing resin, which can deteriorate and reduce adhesion, and require screwing or soldering for fixation.
Innovation Solution
An electronic unit design where a heat sink with a recessed peripheral wall is positioned on a substrate, separated from the heat-generating component by a hot-melt resin layer that covers the substrate and side face of the heat sink, allowing effective heat transfer and adhesion-based fixation without direct contact between the component and resin, and using hot-melt molding to form the resin layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the heat sink is filled with hot-melt sealing resin to retain it on the substrate, then the heat sink is securely fixed, but the heat radiation efficiency deteriorates and the resin may deteriorate at high temperatures
Solution Approach 1:
The heat sink is divided into two functional parts: a lower part that contacts the substrate for fixation and heat transfer, and an upper radiating part that remains exposed for heat dissipation. The peripheral wall creates a spatial segmentation that prevents resin from reaching the electronic component while allowing the radiating surfaces to remain accessible.
Solution Approach 2:
Different parts of the heat sink are designed with different properties: the lower part has a flat end face for adhesive bonding to the substrate, while the upper part has radiating fins with high surface area for heat dissipation. The resin is applied locally only where fixation is needed, not where heat radiation is required.
2Reliability
If hot-melt resin is used to fill and retain the heat sink, then fixation is achieved, but the resin deteriorates when exposed to high temperatures from the electronic component
Solution Approach 1:
The peripheral wall acts as an intermediary barrier between the hot electronic component and the temperature-sensitive resin. It creates a physical separation that protects the resin from direct exposure to high temperatures while still allowing the resin to perform its fixation function on the cooler lower part of the heat sink.
Solution Approach 2:
The resin is extracted from the interior space of the heat sink and applied only to the external surface of the lower part. This removes the resin from the high-temperature environment inside the heat sink while preserving its fixation function on the substrate.
3Ease of manufacture
If the heat sink is integrally formed with the housing case, then manufacturing is simplified, but the heat radiation efficiency deteriorates due to resin filling
Solution Approach 1:
The heat sink is segmented into a lower fixation part and an upper radiating part, allowing differential treatment: the lower part can be integrally formed with the housing for manufacturing simplicity, while the upper part remains separate to maintain heat radiation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat radiation efficiency, prevents resin deterioration, and eliminates the need for screwing or soldering by firmly adhering the heat sink to the substrate, ensuring effective heat transfer and structural integrity.
Implementation Method 1
The hot-melt resin layer covers at least part of the surface of the substrate and at least part of the side face of the peripheral wall of the heat sink
Implementation Method 2
heat from the electronic component is transferred to the housing case through the sealing resin
Data Source
AI summary
A digital amplifier integrated circuit (“IC”), which is a heat-generating electronic component, is mounted on an upper surface of an insulating substrate. The digital amplifier IC is disposed inside a recess of a heat sink. The heat sink includes a peripheral wall having an end face placed on the upper surface of the insulating substrate. A hot-melt resin layer, molded by hot-melt molding, covers the upper surface of the insulating substrate. The hot-melt resin layer is in contact with a side face of the peripheral wall and retains the heat sink on the insulating substrate. The recess of the heat sink has no hot-melt resin therein.