Heat Sink Segmentation for Short Circuit Prevention

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Solution Overview

Problem

The existing electronic devices face the risk of short circuits between electrical conductors and heat sinks due to insulation gaps, which can be compromised by component tilting or substrate warping, leading to increased physical size and reduced heat dissipation.

Innovation Solution

An electronic device design featuring a heat sink with non-abutting and abutting surfaces, where the abutting surface is positioned closer to the substrate than the non-abutting surface, ensuring the insulating material interposes between the electrical conductor and the non-abutting surface, preventing short circuits while maintaining effective heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the insulation gap between the electrical conductor and heat sink is increased to prevent short circuits, then reliability is improved, but the physical size of the electronic device increases and heat dissipating property degrades

Engineering Contradiction:

Improveshort circuit preventionVSAvoiddevice physical size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The heat sink is divided into two distinct surfaces: a non-abutting surface that faces the electrical conductor to maintain insulation gap, and an abutting surface positioned closer to the substrate for mechanical support. This segmentation allows the heat sink to simultaneously maintain safe electrical distance while minimizing overall device volume.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

An insulating and heat dissipating material is introduced as an intermediary substance between the non-abutting surface of the heat sink and the electrical conductor. This material provides both electrical insulation and thermal conduction, preventing short circuits while maintaining effective heat dissipation without requiring increased spacing.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If the insulation gap is increased to prevent short circuits, then reliability is improved, but heat dissipating property degrades

Engineering Contradiction:

Improveshort circuit preventionVSAvoidheat dissipation efficiency

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The insulating and heat dissipating material serves as a dual-function intermediary that provides both electrical insulation to prevent short circuits and thermal conduction to maintain efficient heat dissipation from the electrical conductor to the heat sink.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The thermal conductivity and electrical resistivity parameters of the material between the heat sink and electrical conductor are optimized by selecting an insulating and heat dissipating material that simultaneously provides high electrical resistance and high thermal conductivity, resolving the contradiction between insulation and heat dissipation.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If the insulation gap is increased to prevent short circuits, then reliability is improved, but the amount of heat dissipating gel required increases

Engineering Contradiction:

Improveshort circuit preventionVSAvoidheat dissipating gel amount

Core Design Contradiction:

ReliabilityVSQuantity of substance

Solution Approach 1:

The heat sink surface is segmented into a non-abutting surface positioned to maintain minimal insulation gap with the electrical conductor, and an abutting surface positioned closer to the substrate. This segmentation minimizes the volume of heat dissipating gel required while ensuring reliable electrical insulation.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively prevents short circuits, allows for miniaturization of the device, and enhances heat dissipation, enabling higher electrical current supply and reduced manufacturing complexity.

Implementation Method 1

the heat sink is configured to absorb heat which is generated from the electronic component when the electronic component is energized

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

this electronic device dissipates the heat to the heat sink through the heat conducting sheet

Methodology Applied

Scientific EffectHeat dissipation: Heat Sink

Implementation Method 3

an insulating and heat dissipating material disposed on a side of the electronic component opposite from the substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10374490B2Electronic device and drive device including the same

Publication Date: 2019.08.06 DENSO CORP

AI summary

An electronic device includes a heat sink, where heat dissipating gel is interposed between the heat sink and a side of an electronic component, which is mounted on a substrate, opposite from the substrate. The electronic component includes an electrical conductor electrically connected to a chip, and an insulator portion that molds the chip with the electrical conductor. The heat sink includes a non-abutting surface that faces the electrical conductor of the electronic component, the heat dissipating gel interposed between the non-abutting surface and the electrical conductor, and an abutting surface that is positioned closer toward the substrate than the non-abutting surface is and abuttable with the insulator portion. Accordingly, when the abutting surface of the heat sink abuts the insulator portion of the electronic component, the non-abutting surface of the heat sink is prevented from abutting the electrical conductor of the electronic component.