Integrated Heat Sink and Shielding Can for Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electrical device packages face challenges in balancing heat dissipation, electromagnetic compatibility, and space consumption, with a need to improve these aspects while reducing the number of components and overall size.
Innovation Solution
The use of a heat sink with surface-enlarging structures as a cap for the electromagnetic shielding encapsulation, combined with a gasket material for thermal conductivity and electromagnetic shielding, reduces the number of components and space consumption while enhancing heat dissipation and electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional separate heat sink and electromagnetic shielding components are used, then heat dissipation and electromagnetic compatibility are achieved, but the number of components and space consumption increase
Solution Approach 1:
The patent combines the heat sink and electromagnetic shielding components into a single integrated structure. The shielding can acts as both the electromagnetic shielding enclosure and the heat dissipation component, eliminating the need for separate heat sink components while maintaining both functions effectively
2Reliability
If traditional separate heat sink and electromagnetic shielding components are used, then heat dissipation and electromagnetic compatibility are achieved, but space consumption increases
Solution Approach 1:
The shielding can is designed to perform dual functions as both electromagnetic shielding and heat dissipation, reducing the overall volume required by eliminating separate components and their associated mounting spaces, gaps, and interfaces
3Temperature
If heat dissipation is improved through additional components, then thermal resistance is reduced, but device complexity and space consumption increase
Solution Approach 1:
The shielding can is designed with multi-functionality, serving as both the electromagnetic shielding enclosure and the heat dissipation component. The thermal conductivity of the shielding can material enables effective heat dissipation without requiring additional heat sink components
Solution Approach 2:
The patent merges the heat dissipation function into the shielding can structure itself, using the can's inherent thermal conductivity and surface area for heat dissipation, thereby reducing thermal resistance without adding component complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces thermal resistance and junction temperature, enabling efficient heat dissipation and electromagnetic shielding without compromising space or adding extra components, thus improving the performance and reliability of electrical devices.
Implementation Method 1
a gasket material for thermal conductivity and electromagnetic shielding
Implementation Method 2
a heat sink mounted to the sidewalls of the electromagnetic shielding encapsulation, wherein the heat sink forms a cap of the electromagnetic shielding encapsulation
Implementation Method 3
a gasket material for thermal conductivity and electromagnetic shielding
Data Source
AI summary
An electrical device includes at least one electrical component arranged on a carrier substrate and sidewalls of an electromagnetic shielding encapsulation arranged on the carrier substrate. The sidewalls of the electromagnetic shielding encapsulation laterally surround the at least one electrical component. Further, the electrical device includes a heat sink mounted to the sidewalls of the electromagnetic shielding encapsulation. The heat sink forms a cap of the electromagnetic shielding encapsulation and the heat sink includes surface-enlarging structures at a front side of the heat sink.