Integrated Heat Sink and Shielding Mask for Compact Electronics
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Solution Overview
Problem
Existing electronic devices with heat sinks face issues of unreliable bonding between the heat sink and chip due to thermal expansion, leading to inefficient heat dissipation, and lack electromagnetic shielding, especially in small-size communication devices with limited space.
Innovation Solution
An electronic device design incorporating a heat dissipating and electromagnetic shielding mask with a frame, heat sinks, fixers, and a shielding mask that securely attaches the heat sink to the chip and provides double electromagnetic shielding, increasing dissipation area and efficiency while reducing electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a heat sink is directly adhered to the chip to dissipate heat, then heat dissipation efficiency is improved, but the bonding reliability deteriorates due to thermal expansion causing adhesive failure
Solution Approach 1:
The patent merges the heat sink and electromagnetic shielding mask into a single integrated component. The heat sink body serves dual functions: dissipating heat from the chip and providing electromagnetic shielding. This integration eliminates the need for separate adhesive bonding between heat sink and shield, while the unified structure ensures consistent thermal and electromagnetic performance.
Solution Approach 2:
The heat sink is constructed using composite material structure with a metal base material providing thermal conduction and a surface coating layer providing electromagnetic shielding properties. This composite structure achieves both heat dissipation and shielding functions within a single component that maintains bonding reliability.
2Productivity
If a large-size heat sink is installed to improve heat dissipation, then heat dissipation efficiency is improved, but the device size increases which is unacceptable for small-size communication devices
Solution Approach 1:
The patent combines the electromagnetic shielding mask with the heat sink into one integrated component. This merging allows the heat dissipation function and electromagnetic shielding function to be achieved simultaneously within the same spatial envelope, eliminating the need for additional shielding components that would increase device volume.
Solution Approach 2:
The heat sink is designed as a multi-functional component that simultaneously performs heat dissipation and electromagnetic shielding. This universal design allows a single component to fulfill multiple roles, reducing the overall device size while maintaining effective heat dissipation performance.
3Productivity
If an ordinary heat sink is used for heat dissipation, then heat dissipation function is achieved, but electromagnetic wave interference protection is lacking
Solution Approach 1:
The patent integrates the electromagnetic shielding function directly into the heat sink structure. The heat sink body incorporates shielding material or coating that provides electromagnetic wave interference protection while maintaining its heat dissipation capability, eliminating the need for separate shielding components.
Solution Approach 2:
The heat sink employs composite material construction where the base material provides thermal conduction and the surface coating or embedded layers provide electromagnetic shielding properties. This composite structure enables simultaneous achievement of heat dissipation and electromagnetic interference protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures reliable heat dissipation and effective electromagnetic shielding without the need for a large heat sink, maintaining chip performance and compliance with electromagnetic interference regulations, even in compact devices.
Implementation Method 1
the heat generated by the chip is absorbed by the heat sink via the surface contact between the heat sink and the chip
Implementation Method 2
the shielding mask is disposed on the circuit board and comprises a cover and several side boards
Data Source
AI summary
An electronic device, including a circuit board, a communication chip, a first heat sink, a fixer and a shielding mask, is provided. The circuit board has a frame having an opening and several rims surrounding the opening. The communication chip, disposed on the circuit board, is located in the opening of the frame. The first heat sink, disposed on the communication chip, has a first surface facing and contacting the communication chip. The fixer is fixed into the circuit board and the first heat sink, such that the first heat sink remains contacting the communication chip. The shielding mask, disposed on the circuit board, includes a cover and several side boards. The cover covers the communication chip and the first heat sink, such that the cover contacts a second surface of the first heat sink. The side boards are opposite and connected to the rims in parallel.