Heat Sink Socket for Open-Top Electronic Devices
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Solution Overview
Problem
Conventional heat sinks cannot be mounted on electronic devices with open tops, such as image sensors and certain power devices, which hinders effective heat dissipation and may lead to device failures.
Innovation Solution
A heat sink socket with a heat conducting body and insulated electrical terminals that can be mounted above a printed circuit board, allowing for efficient heat dissipation and electrical connectivity, even for devices with top openings, through the use of insulated terminals and optional ground planes, and enhanced with convective or conductive cooling features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat sinks are mounted on electronic devices, then heat dissipation is improved, but devices with open tops (such as image sensors and certain power devices) cannot be cooled effectively
Solution Approach 1:
Instead of mounting the heat sink on top of the device as in conventional designs, this patent inverts the approach by placing the heat sink below the device on the circuit board. The heat conducting body extends upward to contact the device's bottom surface, allowing heat dissipation for open-top devices while maintaining effective thermal coupling.
Solution Approach 2:
The patent introduces a heat conducting body as an intermediary element that bridges the device and the circuit board. This mediator extends vertically to provide thermal coupling between the device's bottom surface and the heat sink structure mounted on the circuit board, enabling cooling for devices that cannot accommodate top-mounted heat sinks.
2Reliability
If electrical terminals are provided for electrical communication, then electrical connectivity is improved, but heat conduction efficiency may be reduced due to insulation requirements
Solution Approach 1:
The patent segments the terminal structure into distinct functional zones: an insulated portion for electrical communication that prevents short circuits, and a exposed heat conducting portion that provides thermal coupling. This segmentation allows the terminal to simultaneously fulfill both electrical and thermal functions without compromising either performance.
Solution Approach 2:
The terminal exhibits local quality differentiation where different portions have different properties. The insulated portion maintains electrical isolation for reliable signal transmission, while the exposed heat conducting portion provides efficient thermal coupling. This localized functional differentiation resolves the contradiction between electrical insulation requirements and heat conduction efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively cools electronic devices that cannot use conventional heat sinks by providing a heat conducting body with insulated terminals for electrical communication and optional ground planes, ensuring reliable operation by preventing overheating.
Implementation Method 1
The basic principle of heat transfer is to transfer thermal energy from a higher temperature device to a lower temperature environment. This is done by conduction and other means.
Implementation Method 2
Heat is carried away from the heat sink by convection and air flow moving over or under the surface of the heat sink.
Implementation Method 3
The outer wall of the insulating terminal frictionally engages the inner wall of the first aperture.
Implementation Method 4
The first electrical terminal has an outer wall that engages the inner insulating aperture wall to frictionally secure the first electrical terminal within the insulating aperture.
Data Source
AI summary
A heat sink socket for cooling electronic devices has a heat conducting body having an upper surface for receiving an electrical component and a lower surface for engaging a supporting circuit board. An insulated terminal has an electrical insulating body supporting a first electrical terminal within the heat conducting body. The first electrical terminal connects an electrical contact of the electrical component to the circuit board. The heat sink socket may include a ground plane on the heat conducting body. The ground plane may have a second electrical terminal that connects an electrical contact of the electrical component to the circuit board.