Heat Sink Apparatus for Solid State Light Thermal Management

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Solution Overview

Problem

The operational power of solid state lights, such as LEDs, is limited by their ability to dissipate heat, with excessive heat reducing performance and operational life, necessitating improved heat dissipation methods.

Innovation Solution

A heat sink apparatus with an elongated element and a plurality of fins is used to enhance heat dissipation, either as a separate device affixed to the solid state light or integrated with it, maximizing convective heat transfer and surface area for air flow.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If the current of solid state light is increased to achieve higher power and brightness, then the illumination intensity is improved, but the heat generated increases which reduces performance and operational life

Engineering Contradiction:
ImprovebrightnessVSAvoidheat generated
Core Design Contradiction:
Illumination intensityVSTemperature

Solution Approach 1:

The patent extracts the heat dissipation function from the solid state light itself by attaching a separate heat sink apparatus. The heat sink with its fins and elongated element conducts heat away from the LED junction, removing the thermal burden from the light source and allowing higher current operation without excessive temperature rise.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The heat sink apparatus extends the heat dissipation into a third dimension by using vertical fins and an elongated structure that projects away from the light source. This dimensional extension dramatically increases the surface area available for convective and radiative heat transfer, enabling effective cooling at higher power levels.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If a heat sink apparatus is added to improve heat dissipation, then the temperature control is improved, but the device complexity increases

Engineering Contradiction:
Improveheat dissipationVSAvoidstructure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the heat sink apparatus with the solid state light assembly in a unified structure. The heat sink is positioned to directly contact or closely approach the light source, combining the lighting and thermal management functions into a single integrated unit that can be installed as one component.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The heat sink apparatus serves multiple functions: it conducts heat away from the LED, provides structural support for mounting, and can be designed to accommodate different LED types and configurations. This multi-functionality reduces the need for additional separate components, offsetting the added complexity with functional consolidation.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution allows for increased power and brightness of solid state lights by effectively shifting the burden of heat dissipation to a separate or integrated heat sink, optimizing lighting performance without requiring redesign of traditional fixtures.

Implementation Method 1

a plurality of fins for dissipating heat generated by the solid state light, the fins extending from the elongated element

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

heat dissipating portion positioned between the first end and the second end

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 3

a heat sink comprising a first end configured for connection to a solid state light... heat dissipating portion positioned between the first end and the second end

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS7891838B2Heat sink apparatus for solid state lights
Publication Date: 2011.02.22 BRIDGELUX INC
  • US7891838B2 patent drawing
  • US7891838B2 patent drawing
  • US7891838B2 patent drawing

AI summary

Embodiments of the current invention seek to increase heat dissipation by affixing a separate or integrated heat sink to the solid state light, thus accomplishing increased heat dissipation via a device different from the light, alleviating need for altering the solid state light itself. In this manner, embodiments of the invention increase the amount of heat dissipated from solid state lights without requiring any redesign of the solid state lights themselves.