Press-Fit Connector Heat Sink Alignment to Prevent Terminal Buckling
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Solution Overview
Problem
The conventional circuit connection devices require a separate terminal alignment member, increasing parts and manufacturing steps, leading to higher costs and potential misalignment issues during assembly, which can cause buckling of press-fit terminals.
Innovation Solution
A circuit connection device design that incorporates a connector with positioning protrusions, a circuit substrate with aligned through holes, and a heat sink with corresponding positioning holes, allowing for precise alignment and assembly without additional components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a terminal alignment member is separately provided to guide press-fit terminals, then the insertion of press-fit terminals through terminal through holes is facilitated, but the number of parts and manufacturing steps increase, leading to higher product cost and manufacturing cost
Solution Approach 1:
The patent merges the terminal alignment function with the heat sink by forming guide through holes directly in the heat sink. This integration eliminates the need for a separate terminal alignment member, reducing the number of parts while maintaining the alignment and guidance function for press-fit terminals during assembly
Solution Approach 2:
The heat sink is given multiple functions: it serves both as a thermal management component and as a positioning/alignment structure for the connector and press-fit terminals. The guide through holes in the heat sink provide alignment guidance, making the heat sink a multi-functional component that reduces overall device complexity
2Manufacturing precision
If a terminal alignment member is separately provided, then alignment guidance is achieved, but additional manufacturing steps for attaching the alignment member to the circuit substrate are required, increasing manufacturing cost
Solution Approach 1:
The alignment function is merged into the heat sink structure itself through the formation of guide through holes. This eliminates the need for separate attachment steps for an alignment member, as the heat sink inherently provides the alignment guidance during the assembly process
Solution Approach 2:
The guide through holes are pre-formed in the heat sink during heat sink manufacturing, so that when the heat sink is assembled to the circuit substrate, the alignment function is already in place. This preliminary preparation of alignment features eliminates the need for additional alignment member attachment steps
3Temperature
If the connector and circuit substrate are positioned with a gap due to heat sink placement, then heat dissipation is achieved, but it becomes difficult to insert press-fit terminals through terminal through holes
Solution Approach 1:
The patent resolves the spatial conflict by using the thickness dimension of the heat sink to provide alignment guidance. The guide through holes extend through the heat sink thickness, allowing press-fit terminals to be guided through the gap region created by the heat sink's presence, thus maintaining both heat dissipation capability and terminal insertion feasibility
Data Source
AI summary
A circuit connection device includes a connector that has a connection terminal that is connected to an outside, a press-fit terminal that is connected to the connection terminal, and a positioning protrusion that extends parallel to the press-fit terminal; a circuit substrate in which a terminal through hole into which the press-fit terminal is press-inserted and a first positioning through hole through which the positioning protrusion is inserted are formed, and a heat sink which has a first surface fixed to the circuit substrate, and a second surface disposed on an opposite side of the first surface and fixed to the connector, and in which a second positioning through hole through which the positioning protrusion is inserted is formed.