Heat Sink Component Assembly for Thin High-Power Substrates
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Solution Overview
Problem
Electrical circuits, such as power amplifier circuits, generate heat during operation, leading to potential overheating and damage if heat dissipation is not adequately managed, and thicker substrates can hinder heat dissipation, limiting power handling capability.
Innovation Solution
A component assembly is created with a heat sink component made of thermally conductive, electrically non-conductive material, featuring one or more electrically conductive layers, and an electrical component with a conductive pattern, where the electrical component is disposed on the heat sink to facilitate heat dissipation and mechanical integrity, allowing for the thinning of the electrical component substrate without compromising functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a thicker substrate is used to ensure structural integrity, then mechanical strength is improved, but heat dissipation is hindered and power handling capability is limited
Solution Approach 1:
The patent employs a composite substrate structure combining a thin substrate layer with an integrated heat sink component. The substrate provides mechanical support while the heat sink portion, made of thermally conductive material, efficiently dissipates heat. This composite approach allows the substrate to be thinner without compromising either structural integrity or heat dissipation performance.
2Temperature
If heat dissipation is improved by thinning the substrate, then power handling capability is increased, but mechanical strength is compromised
Solution Approach 1:
The patent merges the substrate and heat sink into a single integrated component. The heat sink is formed as an integral part of the substrate structure, combining the mechanical support function of the substrate with the thermal management function of the heat sink. This integration allows the substrate to be thinner while maintaining both mechanical strength and heat dissipation capability.
3Power
If electrical component substrate is thinned to extreme levels, then power handling capability is increased, but mechanical stability is compromised
Solution Approach 1:
The patent uses a composite structure where a thin substrate layer is combined with a heat sink component that has both thermal and mechanical properties. The heat sink portion compensates for the reduced mechanical stability of the thinned substrate while providing efficient heat dissipation pathways, enabling extreme thinning without compromising mechanical stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages heat flow, increasing the power handling capability of the electrical component by allowing it to be thinned to extreme levels while maintaining mechanical strength and stability, thereby preventing overheating.
Implementation Method 1
a heat sink component including a heat sink substrate comprising a thermally conductive material
Data Source
AI summary
A component assembly can include an electrical component disposed on a heat sink component to mechanically stabilize the electrical component such that the electrical component may be relatively thin. For example, the heat sink component can include a heat sink substrate comprising a thermally conductive material that is electrically non-conductive. The heat sink substrate can have a first surface and a second surface opposite the first surface, with an electrically conductive layer formed over the second surface of the heat sink substrate. The electrical component can include a component substrate having a first surface and a second surface opposite the first surface, and an electrically conductive pattern can be formed over the first surface of the component substrate. The second surface of the component substrate can be disposed adjacent the first surface of the heat sink substrate.