Heat Sink Cavity Sealing for Stable TIM Package Cooling
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Solution Overview
Problem
Conventional semiconductor packages face heat dissipation issues due to the expansion of fluid thermal interface materials (TIM) at high temperatures, leading to insufficient heat dissipation and potential overheating, as they overflow and lose contact with the semiconductor chip and heat sink.
Innovation Solution
An electronic package design featuring a heat sink with openings to accommodate a high thermal conductivity heat dissipation material, which is sealed by a heat dissipation lid with through holes to prevent material loss and ensure stable contact, along with a manufacturing method that uses existing materials and processes to control costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If fluid thermal interface material (TIM) is used to bond the heat sink to the semiconductor chip, then heat dissipation efficiency is improved, but the TIM expands at high temperature and overflows onto the packaging substrate, causing insufficient heat dissipation
Solution Approach 1:
The heat sink is divided into a top sheet and a bottom sheet with a cavity between them. The fluid TIM is contained within this cavity rather than being applied as a continuous layer across the entire chip surface. This segmentation allows the TIM to be isolated in a controlled environment where its thermal expansion won't cause overflow, while still maintaining effective thermal contact with the chip through the cavity walls and designated contact areas.
Solution Approach 2:
The cavity structure acts as an intermediary container that mediates between the fluid TIM and the external environment. It provides a confined space that allows the TIM to expand freely without overflowing onto the packaging substrate, while ensuring continuous thermal contact with the semiconductor chip through the cavity's design features such as side walls and bottom contact surfaces.
2Loss of energy
If fluid TIM is used to improve heat dissipation, then thermal conductivity is improved, but the TIM loses contact with the heat sink at high temperature due to expansion
Solution Approach 1:
The heat sink is divided into a top sheet and a bottom sheet with a cavity between them. The fluid TIM is contained within this cavity rather than being applied as a continuous layer across the entire chip surface. This segmentation allows the TIM to be isolated in a controlled environment where its thermal expansion won't cause overflow, while still maintaining effective thermal contact with the chip through the cavity walls and designated contact areas.
Solution Approach 2:
The invention changes the physical state containment parameters by providing a closed cavity structure that constrains the fluid TIM within specific boundaries. This allows the TIM to undergo thermal expansion without changing its position relative to the heat sink, as the cavity walls provide physical constraints that maintain contact pressure and positioning accuracy throughout the temperature range.
3Device complexity
If conventional packaging colloid is used to cover the semiconductor chip, then packaging is simplified, but heat dissipation is insufficient due to poor thermal conductivity
Solution Approach 1:
The invention extracts the heat dissipation function from the conventional packaging colloid by introducing a separate, dedicated heat sink structure with fluid TIM. Instead of relying on the packaging colloid's poor thermal conductivity, the heat sink with its high-conductivity fluid TIM is specifically designed for thermal management, while the packaging colloid can focus on its primary protective and structural functions.
Solution Approach 2:
The invention uses composite material strategies by combining the packaging colloid (for structural protection) with a separate heat sink structure containing fluid thermal interface material (for thermal management). This composite approach allows each material to perform its optimized function - the colloid provides mechanical protection and electrical insulation, while the fluid TIM provides superior heat dissipation through its high thermal conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents heat dissipation failures by limiting the flow range of the heat dissipation material, ensuring efficient heat transfer and preventing overheating, while maintaining cost-effectiveness through the use of existing materials and processes.
Implementation Method 1
a heat dissipation material formed in the opening and in contact with the electronic component
Implementation Method 2
the heat generated by the semiconductor chip is dissipated by the heat dissipation glue and the heat sink
Implementation Method 3
a top surface of the heat sink is usually exposed from the packaging colloid or directly exposed to the atmosphere to obtain a better heat dissipation effect
Data Source
AI summary
An electronic package and a manufacturing method thereof are provided, in which a heat sink with an opening is disposed on an electronic component of a carrier structure, a heat dissipation material is formed in the opening, and a heat dissipation lid is disposed on the opening to cover the heat dissipation material, such that the problem of insufficient heat dissipation due to the loss of the heat dissipation material can be prevented from occurring to the electronic component.