3D-IC Package Heat Sink Sensing for TIM Pressure Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge of managing thermal hotspots and heat dissipation in three-dimensional integrated circuits (3D-ICs) during operation, particularly in chip-on-wafer-on-substrate (CoWoS) and system on integrated chip (SoIC) applications, is exacerbated by the need to prevent thermal interface materials from being pumped out or shifted, leading to potential crack formation and reduced performance.
Innovation Solution
Integration of sensing modules into the heat sink, package lid, and other components to measure properties like pressure, displacement, and stress during the formation process, allowing for real-time adjustments to maintain alignment and even pressure distribution, thereby preventing crack formation and enhancing thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal interface materials are used to manage heat dissipation in 3D-ICs, then thermal management is improved, but the materials may be pumped out or shifted during operation, leading to crack formation and reduced reliability
Solution Approach 1:
Sensing modules are integrated into the heat sink and package lid before assembly to measure pressure, displacement, and stress during the formation process. This preliminary measurement allows for real-time adjustments to be made during assembly, preventing thermal interface materials from being pumped out or shifted, thereby preventing crack formation while maintaining effective heat dissipation
Solution Approach 2:
The sensing modules provide real-time feedback on pressure, displacement, and stress conditions during the assembly and operation of the 3D-IC package. This feedback enables continuous monitoring and adjustment to maintain optimal conditions for both thermal management and prevention of interface material failure, resolving the contradiction between heat dissipation effectiveness and reliability
2Manufacturing precision
If pressure is increased to ensure thermal interface alignment, then alignment precision is improved, but stress concentration may cause crack formation
Solution Approach 1:
Sensing modules measure pressure and stress in real-time during assembly, providing feedback that enables precise control of pressing forces. This allows sufficient pressure to be applied to ensure thermal interface alignment while simultaneously monitoring stress levels to prevent concentration that would lead to crack formation
Solution Approach 2:
The system dynamically adjusts pressure parameters during assembly based on real-time measurements from sensing modules. By changing pressure parameters adaptively rather than applying constant high pressure, the system achieves precise thermal interface alignment while maintaining stress levels below crack formation thresholds
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in improved yield, performance, reliability, and longevity of semiconductor systems by ensuring even pressure and thermal interface alignment, preventing cracks, and maintaining consistent stress levels.
Implementation Method 1
a heat sink disposed on the semiconductor package
Implementation Method 2
heat dissipation in three-dimensional integrated circuits
Implementation Method 3
a first thermal interface material disposed between the semiconductor package and the heat sink
Data Source
AI summary
In an embodiment, a method includes attaching a die to an interposer; attaching and electrically coupling the interposer to a package substrate; attaching a package lid and a first thermal interface material to the die and to the package substrate; attaching and electrically coupling the package substrate to an assembly substrate; and attaching a heat sink and a second thermal interface material to the package lid using a screw extending between the heat sink and the assembly substrate, the heat sink comprising first sensing modules in physical contact with the second thermal interface material.