Heat Sink Retention Module With Force-Adjustable Wire Modules
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Solution Overview
Problem
Current heat sink attachment methods are unreliable, difficult to install, and compromise thermal efficiency due to uneven pressure application and protruding fasteners, which can damage processors during shipping and reduce thermal effectiveness.
Innovation Solution
A heat sink retention module comprising a frame, wire modules with pivotally coupled arm sections and spring clips, and a latch that applies a uniform downward force to secure the heat sink without protruding fasteners, allowing for tool-less installation and adjustment for various processor heights.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If screws or spring-loaded fasteners are used to attach the heat sink, then the heat sink can be securely mounted, but the fasteners protrude through the heat sink and reduce thermal efficiency
Solution Approach 1:
The patent removes the traditional screw or spring-loaded fastener attachment method from the heat sink structure. Instead, the retention module uses a separate frame with wire modules that apply pressure to the heat sink base without any protruding elements through the heat sink fins, thereby maintaining full thermal efficiency while achieving secure mounting.
Solution Approach 2:
The patent introduces a retention module as an intermediary device between the circuit board and the heat sink. This module includes a frame that attaches to the circuit board and wire modules that apply pressure to the heat sink base, eliminating the need for direct attachment methods that would protrude through the heat sink and compromise thermal performance.
2Productivity
If simple mechanical clips are used to maintain pressure between the heat sink and processor, then thermal contact is improved, but the clips are difficult to install and unreliable during shipping
Solution Approach 1:
The patent employs wire modules with spring clips that can dynamically adjust to the processor height and heat sink base position. The wire modules pivot about transverse axes and can be adducted or abducted, allowing the spring clips to automatically apply the correct amount of pressure regardless of slight variations in component heights, making installation simple and reliable.
Solution Approach 2:
The spring clips on the wire modules automatically self-adjust to apply the necessary pressure between the heat sink and processor. The springs provide continuous force that adapts to the specific geometry of the installation, eliminating the need for complex adjustment mechanisms or difficult manual calibration during installation.
3Productivity
If high pressure is applied between the heat sink and processor, then thermal flow is improved, but the risk of damage during shipping increases
Solution Approach 1:
The patent incorporates spring-loaded wire modules that provide cushioning between the heat sink and processor. The springs absorb shock and distribute pressure evenly, preventing damage during shipping while maintaining the necessary thermal contact pressure during operation. The modular design also allows the heat sink to be easily removed and reinstalled without damage.
4Adaptability or versatility
If a standard retention module is used for various processor heights, then versatility is improved, but the pressure application uniformity becomes difficult to maintain
Solution Approach 1:
The patent uses multiple wire modules with spring clips at different locations on the heat sink base. Each spring clip independently applies pressure at its specific location, and the distributed arrangement ensures uniform pressure distribution across the entire heat sink/processor interface, even when accommodating processors of various heights with a single standard retention module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a reliable, tool-less method for securing heat sinks that maintains thermal effectiveness by applying uniform pressure, reducing the risk of damage during installation and accommodating processors of different heights with a standard retention module and adjustable latch.
Implementation Method 1
spring clips that extend generally perpendicular to each arm section... When the wire modules are adducted and flexed, a generally downward force is applied to the heat sink base by spring clips
Data Source
AI summary
A heat sink retention module including a frame, first and second wire modules and a latch. The frame receives a heat sink base and is securable to a circuit board. First and second wire modules each include a pair of arm sections pivotally coupled to opposing sides of the frame about a transverse axis, a transverse handle section, and a spring clip formed adjacent the pivoting end of each arm section. The transverse axis of the first wire module is longitudinally spaced apart from the transverse axis of the second wire module. When the wire modules are adducted and flexed, a generally downward force is applied to the heat sink base by the spring clips, which extend generally perpendicular to each arm section. The wire modules are kept in the adducted position by a latch selectively securable between the transverse handle sections of the first and second wire modules.