Heat Sink Layer on Write Pole for HAMR Thermal Management
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Solution Overview
Problem
Heat-assisted magnetic recording (HAMR) devices face limitations in areal data density due to superparamagnetic effects, which are addressed by using a high magnetic coercivity medium, but managing the high temperatures generated during the recording process poses a challenge for maintaining data integrity and reducing thermal damage to components.
Innovation Solution
Incorporating a heat sink layer made of plasmonic material along the back and aperture-facing surfaces of the write pole, which is thermally and optically coupled to the near-field transducer, helps dissipate heat and maintain the magnetic state of the recording medium, thereby enhancing data storage reliability and minimizing thermal damage to the recording head components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a high magnetic coercivity medium is used to overcome superparamagnetic effects, then data storage reliability is improved, but thermal management becomes more challenging due to higher operating temperatures
Solution Approach 1:
The patent segments the write pole structure by adding a separate heat sink layer with thermal vias, dividing the thermal management function from the magnetic writing function. This allows the write pole to maintain high coercivity for reliable data storage while the heat sink layer independently manages thermal dissipation.
Solution Approach 2:
The heat sink layer acts as an intermediary between the write pole and the substrate, providing a thermal conduction path that mediates heat transfer. The thermal vias serve as intermediate conductive elements that bridge the gap between the write pole and the heat sink, enabling efficient heat removal without compromising the magnetic properties of the write pole.
2Object-affected harmful factors
If heat is dissipated more aggressively from the near-field transducer, then thermal damage to components is reduced, but the media-to-head temperature ratio may be compromised
Solution Approach 1:
The heat sink layer is strategically positioned and designed with specific thermal conductivity properties to create localized thermal management. The thermal vias are placed in specific patterns to direct heat flow away from sensitive components while maintaining appropriate temperatures at the media interface, achieving different thermal conditions in different locations of the recording head.
Solution Approach 2:
The patent modifies thermal parameters by introducing a heat sink layer with specific thermal conductivity and configuring thermal via dimensions and spacing. These parameter changes enable controlled heat dissipation that protects components from thermal damage while preserving the necessary temperature gradient for effective HAMR operation.
3Temperature
If the write pole structure is modified to include a heat sink layer, then thermal management is improved, but device complexity increases
Solution Approach 1:
The heat sink layer is merged with the write pole structure, forming an integrated thermal management system. The thermal vias are combined with the existing pole structure fabrication process, merging thermal management functionality with the magnetic writing component rather than adding completely separate systems.
Solution Approach 2:
The heat sink layer serves multiple functions: it dissipates heat from the write pole, provides a thermal conduction path, and can be integrated with existing substrate structures. This multi-functionality reduces the need for additional separate thermal management components, offsetting the initial structural addition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation of a heat sink layer improves the media-to-head temperature ratio, reducing thermal damage and maintaining high coupling efficiency, thus effectively addressing the limitations of HAMR devices in achieving higher areal data density while ensuring reliable data storage.
Implementation Method 1
Heat from the near-field transducer is dissipated via a heat sink layer of the plasmonic material that is disposed along the back surface and the aperture-facing surface of the write pole
Implementation Method 2
Surface plasmons are excited along walls of an aperture of the near-field transducer and along a notch protruding within the aperture
Data Source
AI summary
A recording head includes a near-field transducer proximate a media-facing surface. The near-field transducer includes an aperture surrounded by walls of plasmonic material and a notch protruding within the aperture. The walls are oriented normal to the media-facing surface. A write pole is proximate the near-field transducer. The write pole has a back surface facing away from the media-facing surface and an aperture-facing surface proximate the aperture. A heat sink layer of the plasmonic material is disposed along the back surface and the aperture-facing surface of the write pole. The heat sink layer is thermally and optically coupled to the near-field transducer.