Heat Source Simulation Structure for Thermal Testing
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Solution Overview
Problem
Current heat source simulation devices for electronic devices suffer from non-uniform heating structures, leading to significant heat transfer losses and measurement inaccuracies due to thermal resistance and self-dissipation of the heating device, resulting in unreliable heat dissipation test results.
Innovation Solution
A heat source simulation structure comprising a heating body and member connected via welding, enclosed in a high-temperature-resistant insulation outer case and substrate, with a thermocouple for precise temperature monitoring, minimizing heat loss and thermal resistance, and allowing for controlled heating to match electronic component heat profiles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional heating devices (ceramic heating plate, heating filament, heating block) are used to simulate heat generation, then the electronic device heat dissipation can be tested, but the heating structure becomes non-uniform and incompatible, leading to significant heat transfer loss and measurement inaccuracy
Solution Approach 1:
The patent merges the heating member and heating body into an integrated heating assembly where the heating member is embedded within the heating body. This unified structure eliminates the non-uniform heating problem caused by separate heating components and reduces heat transfer loss through optimized thermal coupling, directly improving measurement accuracy.
Solution Approach 2:
The heating body采用高导热系数的复合材料的加热体，which improves heat distribution uniformity and reduces thermal resistance. This composite material approach resolves the contradiction by maintaining thermal efficiency while enabling accurate heat dissipation measurement.
2Measurement precision
If the heating device operates independently without insulation, then the structure is simple, but the heating device itself dissipates heat to the environment, affecting measurement precision
Solution Approach 1:
The patent introduces an insulation layer as an intermediary between the heating assembly and the environment. This insulation layer prevents unwanted heat dissipation to the surroundings while maintaining the simplicity of the overall structure, thereby improving temperature measurement accuracy without significantly complicating the device.
3Area of stationary object
If separate heating modules are used to heat different regions, then the heating coverage is increased, but the heat transfer between modules becomes unstable and contact thermal resistance increases
Solution Approach 1:
The patent combines multiple heating functions into a single integrated heating body with embedded heating members positioned at different locations. This merging approach ensures stable heat transfer throughout the heating area while maintaining reliable thermal contact, resolving the issue of unstable heat transfer between separate modules.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces heat loss to less than 4%, enhancing measurement precision and reliability by maintaining heat within the simulation structure and accurately simulating electronic component heat dissipation conditions.
Implementation Method 1
at least one heating member, one end of the heating member being disposed in the through hole of the heating body, the other end of the heating member extending out of the outer case to electrically connect with an external power supply for heating the heating body
Implementation Method 2
at least one thermocouple member disposed on one side of the heating body corresponding to the heating member
Implementation Method 3
an outer case and a heating substrate with electrical insulation and heat insulation properties to avoid dissipation of the heat from the heat source main body (by way of heat radiation and environment radiation)
Data Source
AI summary
A heat source simulation structure includes a heating body and a heating member to form a simulation heat source main body for conducting heat. The simulation heat source main body is enclosed in an outer case and a heating substrate with electrical insulation and heat insulation properties to avoid dissipation of the heat. The heating member is electrically connected with an external power supply for heating the heating body. A thermocouple member is disposed on the heating body corresponding to the heating member. A temperature monitoring port is connected with a data collection meter for recording the temperature of the heating body. By means of the heat insulation design enclosing the simulation heat source main body, the contact thermal resistance between the heating member and the heating body is reduced, further to lower the heat loss of the heat source simulation structure and enhance the measurement precision and reliability.